SELF-REPAIRING COMPOSITION, SELF-REPAIRING MATERIALS, SELF-REPAIRING METHODS AND APPLICATIONS
申请人:Perichaud Alain
公开号:US20110057340A1
公开(公告)日:2011-03-10
The invention relates to a micro-encapsulated self-repairing polymerizable composition that comprises at least one selected polymerizable compound to be integrated into organic, inorganic or composite materials for the self-repairing of damages incurred in the use conditions thereof, characterised in that micro-encapsulated polymerizable composition is integrated alone into said materials and, after the release of the microcapsule and in the absence of a catalyst, spontaneously polymerises in the presence of a polymerisation-triggering agent that is absent in said materials but naturally occurs during the use thereof, thus repairing said damages.