N-[4-(N-aminoanilino)phenyl]-4-methylbenzenesulfonamide

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: N-[4-(N-aminoanilino)phenyl]-4-methylbenzenesulfonamide
• 化学式: C₁₉H₁₉N₃O₂S
• 分子量: 353.4
• InChiKey: IZRDFCCARRQUNE-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.7
• 重原子数：
  25
• 可旋转键数：
  5
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.05
• 拓扑面积：
  83.8
• 氢给体数：
  2
• 氢受体数：
  5

文献信息

• CURABLE POLYIMIDES
  申请人：Designer Molecules, Inc.

  公开号：EP3642262A1

  公开（公告）日：2020-04-29
• UV-CURABLE RESIN COMPOSITIONS SUITABLE FOR REDISTRIBUTION LAYERS
  申请人：Designer Molecules, Inc.

  公开号：EP4097756A2

  公开（公告）日：2022-12-07
• LOW MODULUS NEGATIVE TONE, AQUEOUS DEVELOPABLE PHOTORESIST
  申请人：Designer Molecules, Inc.

  公开号：US20150344627A1

  公开（公告）日：2015-12-03

  Hydrophobic, low modulus, photoimagable, functionalized polyimides have been discovered that can be developed using aqueous solutions. In particular, compositions containing the functionalized polyimides of the current invention can be used in the photolithography step for the passivation layer on a silicon wafer to reduce stress in thin wafers, or as a low modulus hydrophobic solder mask. These materials can serve as protective layers in other applications in which a thin, flexible, and hydrophobic polymer is required.
• [EN] LOW MODULUS NEGATIVE TONE, AQUEOUS DEVELOPABLE PHOTORESIST<br/>[FR] PHOTORÉSINE DÉVELOPPABLE AQUEUSE, À FAIBLE MODULE, À TON NÉGATIF
  申请人：DESIGNER MOLECULES INC

  公开号：WO2014081894A1

  公开（公告）日：2014-05-30

  Hydrophobic, low modulus, photoimagable, functionalized polyimides have been discovered that can be developed using aqueous solutions. In particular, compositions containing the functionalized polyimides of the current invention can be used in the photolithography step for the passivation layer on a silicon wafer to reduce stress in thin wafers, or as a low modulus hydrophobic solder mask. These materials can serve as protective layers in other applications in which a thin, flexible, and hydrophobic polymer is required.
• [EN] CURABLE POLYIMIDES<br/>[FR] POLYIMIDES DURCISSABLES
  申请人：DESIGNER MOLECULES INC

  公开号：WO2018237377A1

  公开（公告）日：2018-12-27

  The present invention provides curable, high molecular weight (>20,000 Daltons) polyimide compounds. The polyimides, once cured, possess a wide range of glass transition temperatures, have high tensile strength and high elongation. Furthermore, the cured polyimides are hydrophobic, have high glass transition temperatures, low coefficient of thermal expansion, very low dielectric constant and very low dielectric dissipation factor.