The present disclosure relates to a back grinding tape including a polymer resin layer including a urethane (meth)acrylate resin containing 10 to 40 wt% of a repeating unit derived from a (meth)acrylate monomer or oligomer having a glass transition temperature of 0 °C or higher, wherein the polymer resin layer has a glass transition temperature of -30 °C to 0 °C. The present disclosure also relates to a method of grinding a wafer using the back grinding tape.
本公开涉及一种背面研磨带,包括聚合物
树脂层,该聚合物
树脂层包括聚
氨酯(甲基)
丙烯酸酯
树脂,该聚
氨酯(甲基)
丙烯酸酯
树脂含有 10 至 40 wt%的由
玻璃化转变温度为 0 °C 或更高的(甲基)
丙烯酸酯单体或低聚物衍生的重复单元,其中聚合物
树脂层的
玻璃化转变温度为 -30 °C 至 0 °C。本公开还涉及一种使用背面研磨带研磨晶片的方法。