PHOTOSENSITIVE COMPOSITION, CURED FILM AND PRODUCTION PROCESS THEREOF, AND ELECTRONIC PART
申请人:JSR CORPORATION
公开号:US20140234777A1
公开(公告)日:2014-08-21
It is an object of the present invention to improve the curability of a resin composition and a photosensitive composition suitably employed to form e.g., a surface protecting film and an interlaminar insulating film of e.g., an electronic part, while reducing the internal stress remaining in a substrate when the composition is used to form a cured film on the substrate. The photosensitive composition includes a resin (A) having a phenolic hydroxyl group, a crosslinking agent (B1) having at least two oxazoline groups and a crosslinking agent (B2) having at least two groups represented by —CH
2
OR (wherein R is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an acetyl group) and a photosensitive acid-generating agent (C).
本发明的目的是提高树脂组合物和光敏组合物的可固化性,适用于形成电子部件的表面保护膜和层间绝缘膜等,同时在组合物用于在基板上形成固化膜时减少基板中剩余的内部应力。光敏组合物包括具有酚羟基的树脂(A),至少具有两个噁唑烷基的交联剂(B1),至少具有两个由—CH2OR(其中R是氢原子,具有1至10个碳原子的烷基或乙酰基)表示的基团的交联剂(B2)和光敏酸发生剂(C)。