Phenyl 2-methylidene-4-(oxiran-2-yl)butanoate

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯酚酯
• 英文名称: Phenyl 2-methylidene-4-(oxiran-2-yl)butanoate
• 英文别名: phenyl 2-methylidene-4-(oxiran-2-yl)butanoate
• 化学式: C₁₃H₁₄O₃
• 分子量: 218.25
• InChiKey: YGUFAUGYYFFCCQ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.6
• 重原子数：
  16
• 可旋转键数：
  6
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.31
• 拓扑面积：
  38.8
• 氢给体数：
  0
• 氢受体数：
  3

文献信息

• Method for producing optical member and use of ultraviolet ray cured resin composition for same
  申请人：Nippon Kayaku Kabushiki Kaisha

  公开号：US10179445B2

  公开（公告）日：2019-01-15

  Method for producing an optical member, in which at least two optical substrates, of which at least either has a light shielding portion, are bonded to each other using an ultraviolet ray cured resin composition containing (A) a (meth)acrylate and (B) a photopolymerization initiator, an optical member obtained by the producing method, the use of an ultraviolet ray cured resin composition containing (A) a (meth)acrylate and (B) a photopolymerization initiator, and the ultraviolet ray cured resin composition. A bonded optical member causing little damage to an optical substrate, and exhibiting favorable productivity and excellent cure extent and adherence, for example, a touch panel or a display body unit having an optical substrate having a light shielding portion can be produced by the producing method of the present invention, and an optical member exhibiting high cure extent of resin at a light shielding portion and high reliability can be obtained.

  使用含有(A)(甲基)丙烯酸酯和(B)光聚合引发剂的紫外线固化树脂组合物将至少两块光学基板（其中至少有一块具有遮光部分）相互粘合的光学部件的生产方法、通过该生产方法获得的光学部件、使用含有(A)(甲基)丙烯酸酯和(B)光聚合引发剂的紫外线固化树脂组合物以及紫外线固化树脂组合物。通过本发明的生产方法，可以生产出对光学基板损伤小、生产效率高、固化程度和附着力优异的粘合光学部件，例如，可以生产出具有遮光部的光学基板的触摸屏或显示屏主体单元，并且可以获得在遮光部具有高树脂固化程度和高可靠性的光学部件。
• Method For Producing Optical Member And Use Of Ultraviolet Ray Cured Resin Composition For Same
  申请人：Nippon Kayaku Kabushiki Kaisha

  公开号：US20140248498A1

  公开（公告）日：2014-09-04

  The present invention relates to a method for producing an optical member, in which at least two optical substrates, of which at least either has a light shielding portion, are bonded to each other using an ultraviolet ray cured resin composition containing (A) a (meth)acrylate and (B) a photopolymerization initiator, the method having specific Process 1 to Process 3, an optical member obtained by the producing method, the use of an ultraviolet ray cured resin composition containing (A) a (meth)acrylate and (B) a photopolymerization initiator, and the ultraviolet ray cured resin composition. A bonded optical member causing little damage to an optical substrate, and exhibiting favorable productivity and excellent cure extent and adherence, for example, a touch panel or a display body unit having an optical substrate having a light shielding portion can be produced by the producing method of the present invention, and an optical member exhibiting high cure extent of resin at a light shielding portion and high reliability can be obtained by the producing method of the present invention.
• PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTED WIRING BOARD
  申请人：Kato Kenji

  公开号：US20150037588A1

  公开（公告）日：2015-02-05

  Provided is a photosensitive resin composition which has excellent heat resistance, pore explosion resistance, empty foam resistance and crack resistance. A photosensitive resin composition of the present invention contains (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) a diluent solvent, (D) a compound that has two or more ethylenically unsaturated groups in each molecule and (E) a thermosetting component that has two or more cyclic ether groups and/or cyclic thioether groups in each molecule. This photosensitive resin composition is characterized in that: (A-1) a carboxyl group-containing resin which is obtained by reacting an esterified product of an epoxy group, said esterified product being produced by reacting (a) at least one kind of a bisphenol type epoxy compound and (b) an unsaturated carboxylic acid, with (c) a saturated or unsaturated polybasic acid anhydride is contained as the carboxyl group-containing resin (A); and the thermosetting component (E) has an average epoxy equivalent weight of 200 or more.