3-Cyclopenta-1,3-dien-1-ylpyrrole-2,5-dione

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吡咯烷类
• 英文名称: 3-Cyclopenta-1,3-dien-1-ylpyrrole-2,5-dione
• 英文别名: 3-cyclopenta-1,3-dien-1-ylpyrrole-2,5-dione
• 化学式: C₉H₇NO₂
• 分子量: 161.16
• InChiKey: LIRASPYPJHZRHG-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.4
• 重原子数：
  12
• 可旋转键数：
  1
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.11
• 拓扑面积：
  46.2
• 氢给体数：
  1
• 氢受体数：
  2

文献信息

• [EN] METHOD AND MOLECULES<br/>[FR] MÉTHODE ET MOLÉCULES
  申请人：MEDIMMUNE LLC

  公开号：WO2018218093A1

  公开（公告）日：2018-11-29

  The present invention provides a bioconjugation method and compounds for use therein. The bioconjugation method comprises the step of conjugating a biological molecule containing a first unsaturated functional group with a payload comprising a second unsaturated functional group, wherein the first and second unsaturated functional groups are complementary to each other such that conjugation is a reaction of said functional groups via a Diels-Alder reaction which forms a cyclohexene ring.

  本发明提供了一种生物共轭方法和其中使用的化合物。该生物共轭方法包括将含有第一不饱和官能团的生物分子与包含第二不饱和官能团的荷载物质共轭的步骤，其中第一和第二不饱和官能团互补，使得通过 Diels-Alder 反应发生官能团之间的结合，形成一个环己烯环。
• Mechanochemical Regulation of a Photochemical Reaction
  申请人：California Institute of Technology

  公开号：US20210070741A1

  公开（公告）日：2021-03-11

  A mechanochemically-gated photoswitching molecular systems is described, along with the methods for the synthesis and use thereof. This molecular system comprises a thermally stable diarylethene-dienophile Diels-Alder adduct mechanophore embedded into a polymer chain or network, wherein the mechanophore undergoes the retro [4+2] cycloaddition reaction under mechanical force to reveal a diarylethene photoswitch.

  本文描述了一种机械化学门控光开关分子系统，以及其合成和使用方法。该分子系统包括一个热稳定的二芳基乙烯-二烯丙基丁二酰亚胺Diels-Alder加合物机械诱导断裂单元，嵌入到聚合物链或网络中，其中机械诱导断裂单元在机械力的作用下发生逆[4+2]环加成反应，以显露二芳基乙烯光开关。
• DIENE/DIENOPHILE COUPLES AND THERMOSETTING RESIN COMPOSITIONS HAVING REWORKABILITY
  申请人：Henkel IP & Holding GmbH

  公开号：US20160002510A1

  公开（公告）日：2016-01-07

  Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

  提供了热固性树脂组合物，可用于安装在电路板上的半导体器件，例如芯片尺寸或芯片规模封装（“CSP”），球栅阵列（“BGA”），陆地栅格阵列（“LGA”）等（统称为“子组件”），或半导体芯片。当受到适当条件的影响时，该组合物的反应产物可被可控地重做。
• Diene/dienophile couples and thermosetting resin compositions having reworkability
  申请人：Henkel IP & Holding GmbH

  公开号：US10472548B2

  公开（公告）日：2019-11-12

  Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

  本发明提供的热固性树脂组合物适用于在电路板上安装半导体器件，如芯片尺寸或芯片级封装（"CSP"）、球栅阵列（"BGA"）、陆栅阵列（"LGA"）等（统称为 "子组件"）或半导体芯片。组合物的反应产物在适当的条件下可进行可控的再加工。
• METHOD AND MOLECULES
  申请人：Medimmune, LLC

  公开号：EP3630732A1

  公开（公告）日：2020-04-08