Resin composition for sealing optical device and method of sealing semiconductor element
申请人:Shin-Etsu Chemical Co., Ltd.
公开号:EP1780242A2
公开(公告)日:2007-05-02
The present invention provides a composition for sealing optical devices that can form a coating film that exhibits excellent levels of heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion, and also provides a cured product of the composition, and a sealing method that uses the composition.
A resin composition for sealing an optical device, comprising:
(i) a silylated organopolysiloxane with a polystyrene equivalent weight average molecular weight of 5 × 104 or greater, represented by an average composition formula:
R1a(OX)bSiO(4-a-b)/2
(wherein, R1 represents an alkyl group, alkenyl group, or aryl group; X represents a combination of a group represented by a formula -SiR2R3R4 (wherein, R2 to R4 are monovalent hydrocarbon groups), and an alkyl group, alkenyl group, alkoxyalkyl group or acyl group; a represents a number within a range from 1.00 to 1.5; b represents a number that satisfies 0 < b < 2, and a+b satisfies 1.00 < a+b < 2), and
(ii) a condensation catalyst, as well as a transparent cured product obtained by curing the composition, and a method of sealing a semiconductor element that comprises a step of applying the composition to a semiconductor element, and a step of curing the composition that has been applied to the semiconductor element.
本发明提供了一种用于密封光学设备的组合物,该组合物可形成具有优异的耐热性、抗紫外线性、光学透明性、韧性和附着力的涂膜,还提供了该组合物的固化产品,以及使用该组合物的密封方法。
一种用于密封光学设备的树脂组合物,包括
(i) 聚苯乙烯当量重平均分子量大于或等于 5×104 的硅烷化有机聚硅氧烷,由平均组成式表示; (ii) 聚苯乙烯当量重平均分子量大于或等于 5×104 的硅烷化有机聚硅氧烷,由平均组成式表示:
R1a(OX)bSiO(4-a-b)/2
(其中,R1 代表烷基、烯基或芳基;X 代表由式 -SiR2R3R4 所代表的基团(其中,R2 至 R4 为单价烃基)与烷基、烯基、烷氧基烷基或酰基的组合;a 代表 1.00 至 1.5 范围内的数字;b 代表满足 0 < b < 2 的数字,且 a+b 满足 1.00 < a+b < 2 的数字),以及
(ii) 缩合催化剂,以及通过固化该组合物而获得的透明固化产品,以及一种密封半导体元件的方法,该方法包括将该组合物涂在半导体元件上的步骤,以及将涂在半导体元件上的该组合物固化的步骤。