The invention provides an alkaline aqueous developable photoimageable composition, useful as a photoresist for forming a solder mask on a printed circuit board. The photoimageable composition comprises
A) between 20 and 50 wt% of a binder polymer, the binder polymer (A) comprising a backbone formed of between 45 and 75 mole percent styrene and between 25 and 55 mole percent maleic anhydride, the binder polymer being esterified with an organic alcohol or mixture of organic alcohols each having a molecular weight between 32 and 200 so as to at least half-esterify the anhydride functionality provided by maleic anhydride. The polymer has an acid number between 110 and 270 and a weight average molecular weight between 10,000 and 150,000. Between 20 and 75 wt% of the photoimageable composition comprises
B) photopolymerizeable compounds, including between 20 and 60 wt% of acrylate-functional oligomers selected from:
B1) acrylate functional urethane oligomers having weight average molecular weights between 400 and 3000, and/or
B2) epoxy acrylate oligomers having weight average molecular weights between 400 and 3000.
To achieve a final hardening cure, the composition further contains
C) between 1 and 5 wt% of an aminoplast which, at elevated temperatures reacts with any hydroxyl functional present and with the acid functionality of the binder polymer (A). The composition further contains
D) between 1 and 15 wt% of a photoinitiator chemical system to promote polymerization of the photopolymerizeable compounds (B) when exposed to actinic radiation.
本发明提供了一种碱性
水溶液显影光成像组合物,可用作在印刷电路板上形成阻焊层的光刻胶。这种光成像组合物包括
A)20-50 wt%的粘合剂聚合物,粘合剂聚合物(A)包括由 45-75摩尔%的
苯乙烯和 25-55摩尔%的
马来酸酐形成的骨架,粘合剂聚合物与分子量在 32-200之间的有机醇或有机醇混合物酯化,以便至少半酯化
马来酸酐提供的酸酐官能团。聚合物的酸数在 110 至 270 之间,平均分子量在 10,000 至 150,000 之间。20 至 75 wt%的光成像组合物包括
B) 可光聚合化合物,包括 20 至 60 wt%的选自以下物质的
丙烯酸酯功能性低聚物:
B1) 重量平均分子量在 400 到 3000 之间的
丙烯酸酯官能聚
氨酯低聚物,和/或
B2) 平均分子量介于 400 和 3000 之间的环氧
丙烯酸酯低聚物。
为实现最终硬化固化,该组合物还包含
C) 1 至 5 wt%的
氨基塑料,该
氨基塑料在高温下会与粘合剂聚合物(A)的羟基官能团和酸官能团发生反应。该组合物还含有
D) 1 至 15 wt%的光
引发剂化学体系,用于促进光聚合化合物(B)在光辐射下的聚合。