申请人:MORTON INTERNATIONAL, INC.
公开号:EP0726499A1
公开(公告)日:1996-08-14
A photoimageable composition, useful as a photoresist for forming a printed circuit board, is both alkaline aqueous developable but, subsequent to exposure and development, is processable in highly alkaline environments, such as additive plating baths and ammoniacal etchants. The photoimageable composition comprises A) between 20 and 75 wt% of a binder polymer, B) between 20 and 60 wt% of a photopolymerizable material which is a multifunctional photopolymerizable monomer or short chain oligomer, and C) between 2 and 20 wt% of a photoinitiator chemical system, the weight percentages being based on the total weight of components A)-C). The binder polymer A) is a styrene/maleic anhydride copolymer in which the maleic anhydride residues are mono-esterified to between 50 and 65 mole percent of an alkyl, aryl, cycloalkyl, alkaryl, or arylalkyl alcohol having a molecular weight greater than 100, to between 15 and 50 mole percent of a C1-C3-alkyl alcohol, and to at least 80 mole percent total. The polymer has between 45 and 65 mole percent styrene residues and between 35 and 55 mole percent maleic anhydride residues, a weight average molecular weight of between 80,000 and 200,000, and an acid number of between 170 and 220.
A photoimageable composition containing an epoxy resin and the novel polymer of the present invention is hardenable to form a solder mask.
The novel polymer of the present invention provides tack-free photoimageable compositions, permitting contact imaging.
一种可光成像组合物,可用作形成印刷电路板的光刻胶,既可在碱性水溶液中显影,又可在曝光和显影后在高碱性环境中加工,如添加剂电镀浴和氨化蚀刻剂。光成像组合物包括:A) 20 至 75 wt%的粘合剂聚合物;B) 20 至 60 wt%的可光聚合材料(多功能可光聚合单体或短链低聚物);C) 2 至 20 wt%的光引发剂化学体系,重量百分比基于 A)-C) 组分的总重量。粘合剂聚合物 A) 是苯乙烯/马来酸酐共聚物,其中马来酸酐残留物被单酯化为分子量大于 100 的烷基、芳基、环烷基、烷芳基或芳烷基醇的 50 至 65 摩尔%,C1-C3-烷基醇的 15 至 50 摩尔%,以及至少 80 摩尔%的总量。该聚合物的苯乙烯残基含量在 45 至 65 摩尔%之间,马来酸酐残基含量在 35 至 55 摩尔%之间,平均分子量在 80,000 至 200,000 之间,酸值在 170 至 220 之间。
含有环氧树脂和本发明新型聚合物的可光照成像组合物可硬化形成阻焊层。
本发明的新型聚合物可提供无粘性光成像组合物,允许接触成像。