Urea, N,N''-1,2-phenylenebis[N',N'-dimethyl- | 35263-47-9

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: Urea, N,N''-1,2-phenylenebis[N',N'-dimethyl-
• 英文别名: 3-[2-(dimethylcarbamoylamino)phenyl]-1,1-dimethylurea
• CAS: 35263-47-9
• 化学式: C₁₂H₁₈N₄O₂
• 分子量: 250.3
• InChiKey: PESXPUCWMKUMSI-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.3
• 重原子数：
  18
• 可旋转键数：
  2
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.33
• 拓扑面积：
  64.7
• 氢给体数：
  2
• 氢受体数：
  2

文献信息

• Epoxy resin composition and semiconductor sealing material comprising same
  申请人：MITSUI PETROCHEMICAL INDUSTRIES, LTD.

  公开号：EP0379172A2

  公开（公告）日：1990-07-25

  Disclosed is an epoxy resin composition comprising, as basic components, (A) an epoxy resin, (B) a phenol-novolak resin, (C) a curing promotor and (D) a filler. Pulverized or spherical silica having specific particle size characteristics is used as the filler (D). Preferably, a halogenated epoxy resin and antimony oxide are further incorporated in this epoxy resin. This epoxy resin composition shows a very small molding shrinkage. If a dialkylurea derivative is used as the curing promotor (C), the stability of the composition at about 100°C is drastically improved and the flowability of the composition is improved. Accordingly, precision injection molding becomes possible, and the effect of sealing a semiconductor is enhanced.

  本发明公开了一种环氧树脂组合物，其基本成分包括：(A) 环氧树脂；(B) 苯酚-Novolak 树脂；(C) 固化促进剂；(D) 填料。填料 (D) 采用具有特定粒度特性的粉状或球状二氧化硅。环氧树脂中最好再加入卤化环氧树脂和氧化锑。这种环氧树脂组合物的成型收缩率非常小。如果使用二烷基脲衍生物作为固化促进剂 (C)，组合物在约 100°C 时的稳定性会大大提高，组合物的流动性也会得到改善。因此，精密注塑成型成为可能，密封半导体的效果也得到增强。
• Induction curing electro-coatable seam filler
  申请人：CYTEC TECHNOLOGY CORP.

  公开号：EP0481228A2

  公开（公告）日：1992-04-22

  A synthetic epoxy-based resin seam filler is disclosed.

  公开了一种合成环氧基树脂接缝填充剂。
• A method of injection-molding an epoxy resin composition and an injection-moldable epoxy resin composition
  申请人：MITSUI PETROCHEMICAL INDUSTRIES, LTD.

  公开号：EP0810248A2

  公开（公告）日：1997-12-03

  A method of injection-molding an epoxy resin, which method comprises charging a mini-sprue metal mold comprising a manifold part, a mini-sprue part and an ejector-plate part with an epoxy resin composition possessing latent-type curing characteristics, maintaining the manifold part of the metal mold at a temperature at which the epoxy resin composition is molten but curing of the composition is not promoted, and then injection-molding the composition.

  一种注塑环氧树脂的方法，该方法包括在一个由分流板部分、迷你浇口部分和顶出板部分组成的迷你浇口金属模具中注入具有潜伏型固化特性的环氧树脂组合物，将金属模具的分流板部分保持在环氧树脂组合物熔融但不促进组合物固化的温度下，然后注塑组合物。
• EPOXY RESIN COMPOSITION AND ITS USE
  申请人：Mitsui Chemicals, Inc.

  公开号：EP1331244A1

  公开（公告）日：2003-07-30

  The epoxy resin composition according to the invention contains an epoxy resin and/or an epoxy compound, a curing agent, a curing accelerator and an inorganic filler as main components. The inorganic filler has a particle size of a maximum particle diameter of not more than 10 µm and a mean particle diameter of not more than 3 µm and a slope n of not more than 4.0 in its particle size distribution that is expressed by a Rosin-Rammler's (RRS) diagram, and is contained in the resin composition in an amount of not less than 30 % by weight and not more than 85 % by weight based on the total amount of the resin composition. The slope n is preferably not less than 1.0. The resin composition is preferable for transfer molding or injection molding. This composition is free from deterioration of moldability caused by lowering of flowability and is excellent in mold-transferring properties and excellent dimensional stability. Hence, the composition can provide a precision-molded article having excellent dimensional stability, such as a precision-molded component having a small degree of surface roughness and small circularity. By the use of the resin composition, a precision connector for optical communication, such as a single-core ferrule or a multi-core ferrule, can be produced as resin-made one. Further, the resin composition is excellent in mold-transferring properties and is capable of being injection molded. The precision-molded article according to the invention comprises the resin composition.

  根据本发明，环氧树脂组合物的主要成分包括环氧树脂和/或环氧化合物、固化剂、固化促进剂和无机填料。无机填料的最大粒径不超过 10 微米，平均粒径不超过 3 微米，其粒径分布的斜率 n 不超过 4.0（用罗辛-拉姆勒（RRS）图表示），其在树脂组合物中的含量不低于树脂组合物总量的 30%（重量百分比），不超过 85%（重量百分比）。斜率 n 最好不小于 1.0。该树脂组合物最好用于传递模塑或注射模塑。这种组合物不会因流动性降低而导致成型性变差，并具有优异的模具转移特性和出色的尺寸稳定性。因此，该组合物可以提供尺寸稳定性极佳的精密成型品，例如表面粗糙度小、圆度小的精密成型部件。通过使用该树脂组合物，可以生产出树脂制造的光通信用精密连接器，如单芯插芯或多芯插芯。此外，该树脂组合物还具有优异的脱模性能，可进行注塑成型。根据本发明，精密模塑制品包括树脂组合物。
• LAGERUNGSSTABILE IMPRÄGNIERHARZE UND ELEKTROISOLATIONSBÄNDER
  申请人：Siemens Aktiengesellschaft

  公开号：EP3091049A1

  公开（公告）日：2016-11-09

  Die Erfindung betrifft ein anhydridfreies Imprägnierharz für einen Elektroisolationskörper, wobei das Imprägnierharz ein Epoxidharz, einen Härter und nanoskalige und/oder mikroskalige anorganische Partikel aufweist. Die Erfindung betrifft ferner ein imprägnierbares Elektroisolationsband für einen Elektroisolationskörper (1), wobei ein Härter (4) auf das Elektroisolationsband (1) aufgebracht ist. Die Erfindung betrifft ferner ein Verfahren zum Herstellen eines Elektroisolationskörpers, den Elektroisolationskörper und die Verwendung des Elektroisolationskörpers.

  本发明涉及一种用于电气绝缘体的无酸酐浸渍树脂，其中浸渍树脂包括环氧树脂、固化剂和纳米级和/或微米级无机颗粒。本发明还涉及一种用于电气绝缘体（1）的可浸渍电气绝缘带，其中在电气绝缘带（1）上涂有固化剂（4）。本发明还涉及一种生产电气绝缘体、电气绝缘体和使用电气绝缘体的方法。