N²-acetylphenelzine | 69352-50-7

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: N²-acetylphenelzine
• 英文别名: 1-Acetyl-2-phenethylhydrazine；N'-(2-phenylethyl)acetohydrazide
• CAS: 69352-50-7
• 化学式: C₁₀H₁₄N₂O
• 分子量: 178.234
• InChiKey: JEBNIFLGBKGGIH-UHFFFAOYSA-N

物化性质

• 沸点：
  277.1±23.0 °C(Predicted)
• 密度：
  1.048±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  1.3
• 重原子数：
  13
• 可旋转键数：
  4
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.3
• 拓扑面积：
  41.1
• 氢给体数：
  2
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  Acetic acid [2-phenyl-eth-(E)-ylidene]-hydrazide 在 三乙基硅烷 作用下， 以 三氟乙酸 为溶剂， 反应 4.0h， 以85%的产率得到N²-acetylphenelzine
  参考文献：
  名称：

  Pei-Lin-Wu; Peng, Shao-Yu; Magrath, Joe, Synthesis, 1995, # 4, p. 435 - 438

  摘要：

  DOI：

文献信息

• Adhesive compositions for bonding passive substrates
  申请人：——

  公开号：US20030217808A1

  公开（公告）日：2003-11-27

  Adhesive compositions are disclosed which cure rapidly and completely on confinement between passive substrates, such as magnesium alloys, that are deficient in transition metals and transition metal ions. The compositions include one or more acrylate resins, one or more peroxy free radical initiators, one or more onium salts, and an accelerator such as acetylphenyl hydrazine desirably in an amount of about 1.0% or less by weight of the composition. These compositions provide exceptional bonding to such substrates without the need for a transition metal primer. Methods of making and using such compositions are also disclosed.

  本发明公开了一种粘合组合物，其在被动基材（例如缺乏过渡金属和过渡金属离子的镁合金）之间受限时，可以快速而完全固化。该组合物包括一种或多种丙烯酸酯树脂、一种或多种过氧自由基引发剂、一种或多种离子盐，以及加速剂，例如乙酰苯肼，理想情况下其重量占组合物的1.0%或更少。这些组合物可以在不需要过渡金属底漆的情况下，对这些基材提供出色的粘合性能。本发明还公开了制备和使用这种组合物的方法。
• Anderson,F.E. et al., Journal of medicinal and pharmaceutical chemistry, 1962, vol. 5, # 2, p. 221 - 230
  作者：Anderson,F.E. et al.

  DOI：——

  日期：——
• PREPARATION OF OPTICALLY ACTIVE HYDRAZINES AND AMINES
  申请人：E.I. DU PONT DE NEMOURS AND COMPANY

  公开号：EP0631571A1

  公开（公告）日：1995-01-04
• ADHESIVE COMPOSITIONS FOR BONDING PASSIVE SUBSTRATES SUCH AS MAGNESIUM ALLOYS
  申请人：Henkel Loctite Corporation

  公开号：EP1285037A2

  公开（公告）日：2003-02-26
• METHOD FOR CONNECTING ELECTRODES AND BONDING COMPOSITION USED THEREFOR
  申请人：Chen Chunfu

  公开号：US20120018088A1

  公开（公告）日：2012-01-26

  There is disclosed a method for adhering a first connecting portion comprising a first electrode formed on a transparent substrate and a second connecting portion comprising a second electrode formed on a flexible substrate, whereby electrically connecting the first electrode and the second electrode, the method comprising the steps of: applying a bonding composition on at least one of the first connecting portion and the second connecting portion; aligning the first electrode and the second electrode, and irradiating with light while the first connecting portion and the second connecting portion are pressed so as to contact each other; and allowing the resulting assembly to stand at ambient temperature after the light irradiation; wherein the bonding composition comprises no electrically-conductive particle, but comprises: (a) a curable resin component; (b) a photo cure initiation component; and (c) an anaerobic curing initiation component; and wherein the anaerobic curing is not completed when the photo-irradiation is terminated.