申请人:Kolon Industries, Inc.
公开号:EP3162838A1
公开(公告)日:2017-05-03
This invention relates to a highly heat-resistant polyamic acid solution and a polyimide film having improved thermal dimensional stability, wherein the polyamic acid solution includes a polymer of a diamine compound, containing 1 to 10 mol% of a carboxylic acid functional group-containing diamine compound based on the total amount of diamine, and a dianhydride compound, and the polyimide film includes polyimide, which is an imidized product of the polyamic acid solution and is configured such that main chains thereof are crosslinked through an amide bond (-CONH-).
本发明涉及一种具有高耐热性的聚酰胺酸溶液和一种具有更好热尺寸稳定性的聚酰亚胺薄膜,其中聚酰胺酸溶液包括二胺化合物的聚合物,二胺化合物中含有占二胺总量 1 至 10 摩尔%的含羧酸官能团的二胺化合物和二酐化合物,聚酰亚胺薄膜包括聚酰亚胺,聚酰亚胺是聚酰胺酸溶液的亚胺化产物,其结构使其主链通过酰胺键(-CONH-)交联。