To provide an epoxy resin composition for printed circuit boards which demonstrates little tendency to absorb moisture, high heat-resistance, favorable high temperature properties, resistance to metal migration, favorable anti-fade property at high temperatures, high Tg, high electric insulating performance and resistance against peeling of the copper foil when formed into a printed circuit board, there is provided epoxy resin composition for printed circuit boards, comprising: (a) epoxy resin obtained by glycidyl etherifying a condensation product of a phenol and hydroxybenzaldehyde; (b) a condensation product of bisphenol A and formaldehyde; (c) a flame retardant; (d) a curing agent; (e) one or both of a phenol antioxidant and an organic sulfur compound antioxidant; and (f) a urea derivative. This composition is highly suitable as a material for manufacturing epoxy resin prepreg in general and printed circuit boards.
为了提供一种用于印刷电路板的环氧
树脂组合物,该组合物在形成印刷电路板时具有吸湿性小、耐热性高、高温性能好、抗
金属迁移、高温抗褪色性能好、Tg 高、电绝缘性能高和
铜箔抗剥落等特点,本发明提供了用于印刷电路板的环氧
树脂组合物,该组合物包括(a) 通过
缩水甘油醚化
苯酚和羟基
苯甲醛的缩合产物得到的环氧
树脂;(b) 双
酚 A 和
甲醛的缩合产物;(c) 阻燃剂;(d) 固化剂;(e)
苯酚抗氧化剂和
有机硫化合物抗氧化剂中的一种或两种;以及 (f)
尿素衍
生物。这种组合物非常适合用作制造一般环氧
树脂预浸料和印刷电路板的材料。