申请人:Hitachi Chemical Co., Ltd.
公开号:EP0870805A2
公开(公告)日:1998-10-14
To provide an epoxy resin composition for printed circuit boards which demonstrates little tendency to absorb moisture, high heat-resistance, favorable high temperature properties, resistance to metal migration, favorable anti-fade property at high temperatures, high Tg, high electric insulating performance and resistance against peeling of the copper foil when formed into a printed circuit board, there is provided epoxy resin composition for printed circuit boards, comprising: (a) epoxy resin obtained by glycidyl etherifying a condensation product of a phenol and hydroxybenzaldehyde; (b) a condensation product of bisphenol A and formaldehyde; (c) a flame retardant; (d) a curing agent; (e) one or both of a phenol antioxidant and an organic sulfur compound antioxidant; and (f) a urea derivative. This composition is highly suitable as a material for manufacturing epoxy resin prepreg in general and printed circuit boards.
为了提供一种用于印刷电路板的环氧树脂组合物,该组合物在形成印刷电路板时具有吸湿性小、耐热性高、高温性能好、抗金属迁移、高温抗褪色性能好、Tg 高、电绝缘性能高和铜箔抗剥落等特点,本发明提供了用于印刷电路板的环氧树脂组合物,该组合物包括(a) 通过缩水甘油醚化苯酚和羟基苯甲醛的缩合产物得到的环氧树脂;(b) 双酚 A 和甲醛的缩合产物;(c) 阻燃剂;(d) 固化剂;(e) 苯酚抗氧化剂和有机硫化合物抗氧化剂中的一种或两种;以及 (f) 尿素衍生物。这种组合物非常适合用作制造一般环氧树脂预浸料和印刷电路板的材料。