申请人:Korea Institute of Science and Technology
公开号:US20170022636A1
公开(公告)日:2017-01-26
A cured epoxy resin material is depolymerized by using a composition including a compound represented by the chemical formula of XO
m
Y
n
(wherein X is hydrogen, alkali metal or alkaline earth metal, Y is halogen, m is a number satisfying 1≦m≦8 and n is a number satisfying 1≦n≦6), and a reaction solvent, wherein X is capable of being dissociated from XO
m
Y
n
and Y radical is capable of being produced from XO
m
Y
n
in the reaction solvent. It is possible to carry out depolymerization of a cured epoxy resin material, for example, at 200° C., specifically 100° C. or lower, and to reduce a processing cost and an energy requirement. It is also possible to substitute for a reaction system using an organic solvent as main solvent, so that the contamination problems caused by the organic solvent functioning as separate contamination source may be solved and environmental contamination or pollution may be minimized.