申请人:DUPONT ELECTRONICS, INC.
公开号:US11535710B2
公开(公告)日:2022-12-27
In a first aspect, a single layer polymer film includes 60 to 99 wt % of a crosslinked polyimide, having a gel fraction in the range of from 20 to 100% and a refractive index of 1.74 or less, and 1 to 40 wt % of a colorant. A surface of the single layer polymer film has been textured and has a maximum roughness (S
pv
) of 6 μm or more, an L* color of 30 or less and a 60° gloss of 15 or less. In a second aspect, a coverlay for a printed circuit board includes the single layer polymer film of the first aspect. In third and fourth aspects, processes are disclosed for forming a single layer polymer film including a crosslinked polyimide film including a dianhydride and a diamine.
在第一方面,单层聚合物薄膜包括 60 至 99 wt % 的交联聚酰亚胺,其凝胶部分在 20 至 100% 的范围内,折射率为 1.74 或更低,以及 1 至 40 wt % 的着色剂。单层聚合物薄膜的表面经过纹理处理,具有最大粗糙度(S
pv
)为 6 μm 或以上,L* 颜色为 30 或以下,60° 光泽度为 15 或以下。在第二方面,用于印刷电路板的覆盖层包括第一方面的单层聚合物薄膜。在第三和第四方面,公开了形成单层聚合物薄膜的工艺,该单层聚合物薄膜包括交联聚酰亚胺薄膜,该交联聚酰亚胺薄膜包括二酐和二胺。