申请人:KUGA Yutaka
公开号:US20090130441A1
公开(公告)日:2009-05-21
The present invention is to provide a heat-sensitive adhesive material containing a support;,and an adhesive under layer, an intermediate layer and a heat-sensitive adhesive layer formed over one surface of the support in this order, wherein the intermediate layer contains at least a thermoplastic resin and hollow particles, the heat-sensitive adhesive layer contains at least a thermoplastic resin, an adhesion imparting agent and a thermofusible material, and the adhesive under layer contains at least a thermoplastic resin, the thermoplastic resin has a glass transition temperature (Tg) of −70° C. to −10° C. and a mass average molecular mass of 100,000 to 1,500,000.