The present invention provides a novel diamine and a novel acid anhydride which are applicable for a polyimide and includes a cinnamoyl group or a derived cinnamoyl group. The novel diamines and acid anhydrides have photo-reactivity and heat-reactivity inherent to the cinnamoyl group.
Thermosetting fluorinated dielectrics and multilayer circuit boards
申请人:FUJITSU LIMITED
公开号:US20020076535A1
公开(公告)日:2002-06-20
A dielectric film is obtained by heat curing a thermally curable fluorinated o-aminophenol polymer or oligomer based on an o-aminophenol compound and an aromatic dicarboxylic acid compound, at least one of which is mono- or poly-fluorinated, and having thermosetting groups at both ends that undergo cross-linking reaction upon thermal treatment. The dielectric film is employed in multilayer circuit boards.