Cyclohexamethylenimine 3,5-dinitrobenzoate | 7270-75-9

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: Cyclohexamethylenimine 3,5-dinitrobenzoate
• 英文别名: azepane;3,5-dinitrobenzoic acid
• CAS: 7270-75-9
• 化学式: C13H17N3O6
• 分子量: 311.29
• InChiKey: QSDQBPFMAVYUTI-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.35
• 重原子数：
  22
• 可旋转键数：
  1
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.46
• 拓扑面积：
  141
• 氢给体数：
  2
• 氢受体数：
  7

文献信息

• Conductive and resitive material with electrical stability for use in electronics devices
  申请人：National Starch and Chemical Investment Holding Corporation

  公开号：EP1032038A2

  公开（公告）日：2000-08-30

  An composition with improved electrical stability for use in microelectronic applications comprises a polymeric resin, a conductive filler, optionally either a reactive or a nonreactive diluent, optionally an inert filler, and an oxygen scavenger or corrosion inhibitor or both to provide the electrical stability.

  一种用于微电子应用的具有更高电稳定性的组合物包括聚合物树脂、导电填料、可选的反应性或非反应性稀释剂、可选的惰性填料以及氧清除剂或腐蚀抑制剂或二者兼有，以提供电稳定性。
• Conductive and resistive materials with electrical stability for use in electronics devices
  申请人：National Starch and Chemical Investment Holding Corporation

  公开号：EP1231248A1

  公开（公告）日：2002-08-14

  An composition with improved electrical stability for use in microelectronic applications comprises a polymeric resin, a conductive filler, optionally either a reactive or a nonreactive diluent, optionally an inert filler, and an oxygen scavenger or corrosion inhibitor or both to provide the electrical stability. Alternatively, the composition may also include a low melting point metal filler component.

  一种用于微电子应用的具有更高电稳定性的组合物包括聚合物树脂、导电填料、反应性或非反应性稀释剂、惰性填料、氧清除剂或腐蚀抑制剂或二者兼有，以提供电稳定性。另外，该组合物还可包括低熔点金属填料成分。
• Compositions for use in electronics devices
  申请人：National Starch and Chemical Investment Holding Corporation

  公开号：EP1594351A2

  公开（公告）日：2005-11-09

  A fast curing composition that comprises a polymeric resin, a conductive filler and one or more near-infrared absorbing additives and optionally an oxygen scavenger or corrosion inhibitor or both, and other additives such as reactive or nonreactive diluents, inert fillers, and adhesion promoters. The composition may be conductive, resistive or anisotropically conductive. In another embodiment, this invention is a method for improving the cure speed of a composition by exposing the composition to a near infrared energy source.

  一种快速固化组合物，由聚合树脂、导电填料、一种或多种近红外吸收添加剂、氧清除剂或腐蚀抑制剂或两者，以及其他添加剂（如反应性或非反应性稀释剂、惰性填料和附着力促进剂）组成。组合物可以是导电的、电阻性的或异向导电的。在另一个实施方案中，本发明是一种通过将组合物暴露于近红外能量源来提高组合物固化速度的方法。
• Anisotropic conductive adhesive
  申请人：National Starch and Chemical Investment Holding Corporation

  公开号：EP1832636A1

  公开（公告）日：2007-09-12

  An anisotropic conductive adhesive that provides strong adhesion to metals and organic substrates to generate stable and reliable electric interconnects. The adhesive provides the benefits of short thermocompression bond time at low temperatures. The adhesive contains cationic curable resin, latent cationic catalyst that thermally cures the resin at high speeds and low temperatures, conductive filler, optionally a film forming thermoplastic solid resin and optionally nano size filler. The optional nano filler provides the benefit of reducing the coefficient of thermal energy mismatch, improving the adhesion strength and reducing the total heat of reaction for the system.

  一种各向异性导电粘合剂，可与金属和有机基底产生强大的粘合力，从而产生稳定可靠的电气互连。该粘合剂具有低温热压粘合时间短的优点。该粘合剂包含阳离子可固化树脂、可在高速低温条件下热固化树脂的潜阳离子催化剂、导电填料、可选的成膜热塑性固体树脂和可选的纳米级填料。可选的纳米填料具有降低热能失配系数、提高粘合强度和降低系统总反应热的优点。
• Conductive materials with electrical stability for use in electronics devices
  申请人：——

  公开号：US20020193467A1

  公开（公告）日：2002-12-19

  An composition with improved electrical stability for use in microelectronic applications comprises a polymeric resin, a conductive filler, a curing agent, optionally either a reactive or a nonreactive diluent and a corrosion inhibitor to provide the electrical stability.

  一种用于微电子应用的具有更高电稳定性的组合物由聚合物树脂、导电填料、固化剂、反应性或非反应性稀释剂以及腐蚀抑制剂组成，以提供电稳定性。