3-[3-(4-Aminophenoxy)phenoxy]aniline | 122181-72-0

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 3-[3-(4-Aminophenoxy)phenoxy]aniline
• CAS: 122181-72-0
• 化学式: C₁₈H₁₆N₂O₂
• 分子量: 292.3
• InChiKey: INQGLILZDPLSJY-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.6
• 重原子数：
  22
• 可旋转键数：
  4
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  70.5
• 氢给体数：
  2
• 氢受体数：
  4

文献信息

• [EN] EPOXY RESIN<br/>[FR] RÉSINE ÉPOXY
  申请人：BOEING CO

  公开号：WO2018018070A1

  公开（公告）日：2018-02-01

  The present disclosure relates to epoxide containing compounds comprising three benzene units linked by bridging groups. The disclosure also relates to the production of curable epoxy resin formulations comprising said epoxide containing compounds, and their possible incorporation into composite materials such as fibre reinforced composites. Possible methods for formulating the compounds epoxide containing compounds, as described herein, are also disclosed.

  本公开涉及含有环氧基化合物，其中含有三个苯基单元，由桥接基团连接。本公开还涉及制备可固化环氧树脂配方，其中包括上述含有环氧基化合物，并且可能将其并入复合材料，例如纤维增强复合材料。本公开还揭示了制定本文所述含有环氧基化合物的可能方法。
• Polyimides
  申请人：FUJIFILM ELECTRONIC MATERIALS U.S.A. INC.

  公开号：US11061327B2

  公开（公告）日：2021-07-13

  A polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), (b) at least one diamine of Structure (II), (c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least one second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formulas is defined in the specification.

  一种聚酰亚胺聚合物，包括以下反应产物：(a)至少一种从结构式(Ia)和结构式(Ib)组成的二胺中选择的二胺，(b)至少一种结构式(II)的二胺，(c)至少一种四羧酸二酐，以及可选地(d)至少一种含有第一官能团与胺或酸酐反应的化合物，以及至少一种从取代或未取代的烯烃基和取代或未取代的炔基中选择的第二官能团。上述公式中的每个变量在说明书中有定义。
• POLYAMIC ACID RESIN SOLUTION CONTAINING INTERPENETRATING POLYMER AND LAMINATE USING THE SAME
  申请人：WANG Tsung-Hsiung

  公开号：US20130171459A1

  公开（公告）日：2013-07-04

  Provided is a polyamic acid resin solution containing interpenetrating polymer. The solution includes a polyamic acid resin dissolved in a solvent. The polyamic acid resin includes an interpenetrating polymer formed of polyamic acid twining around hyper-branched polybismaleimide. The hyper-branched polybismaleimide includes a bismaleimide polymer, a bismaleimide oligomer, a barbituric acid-bismaleimide copolymer or combinations thereof.

  提供的是一种含有相互渗透聚合物的聚酰亚胺树脂溶液。该溶液包括在溶剂中溶解的聚酰亚胺树脂。聚酰亚胺树脂包括由聚酰亚胺绕绕着超支化聚双马来酰亚胺形成的相互渗透聚合物。超支化聚双马来酰亚胺包括双马来酰亚胺聚合物、双马来酰亚胺寡聚物、巴比妥酸-双马来酰亚胺共聚物或其组合。
• Flexible multi-layer polyimide film laminates and preparation thereof
  申请人：E.I. DU PONT DE NEMOURS AND COMPANY

  公开号：EP0474054A2

  公开（公告）日：1992-03-11

  Flexible multilayer polyimide metal-clad laminates, and their preparation, having at least one layer of aromatic polyimide bonded to at least one layer of a metallic substrate using a heat-sealable copolyimide adhesive containing repeating imide units derived from 4,4'-oxydiphthalic dianhydride and an aromatic ether diamine. The laminates are used in flexible printed circuits and tape automated bonding applications. Additionally, the metallic substrate may be directly coated with the copolyimide adhesive and used as a single-clad laminate for flexible printed circuits.

  柔性多层聚酰亚胺金属包覆层压板及其制备方法，该层压板至少有一层芳香族聚酰亚胺与至少一层金属基板粘合在一起，使用的是一种可热封的共聚亚胺粘合剂，该粘合剂含有由 4,4'-氧代二酞二酸酐和芳香族醚二胺衍生的重复亚胺单元。这种层压板可用于柔性印刷电路和胶带的自动粘合。此外，金属基板可直接涂覆共聚亚胺粘合剂，并用作柔性印刷电路的单层覆膜。
• Coextruded multi-layer aromatic polyimide film and preparation thereof
  申请人：E.I. DU PONT DE NEMOURS AND COMPANY

  公开号：EP0659553A1

  公开（公告）日：1995-06-28

  A multi-layer polyimide film having excellent adhesion between the layers without using an adhesive, prepared by coextruding a layer of a first poly(amic acid) derived from the reaction of an aromatic tetracarboxylic dianhydride and an aromatic diamine and at least one layer of a second poly(amic acid) derived from the reaction of 4,4'-oxydiphthalic dianhydride and a (diaminophenoxy)benzene to form a self-supporting multi-layer poly(amic acid) film and heat-treating the multi-layer film to completely convert the poly(amic acid) layers to the multi-layer polyimide film. Optionally, the poly(amic acid) solutions may contain fine particles of an inorganic filler to enhance properties of the multi-layer film. The coextruded multi-layer polyimide film is used in the formation of single and double polyimide metal-clad laminates for use in flexible circuit applications.

  一种多层聚酰亚胺薄膜，无需使用粘合剂即可在各层之间形成极佳的粘合力，其制备方法是将一层由芳香族四羧酸二酐和芳香族二胺反应制得的第一层聚(amic acid)和至少一层由 4、4'-oxydiphthalic dianhydride 和 (diaminophenoxy)benzene 反应生成的第二层聚(amic acid)，以形成自支撑多层聚(amic acid)膜，并对多层膜进行热处理，使聚(amic acid)层完全转化为多层聚酰亚胺膜。可选择在聚(胺基酸)溶液中加入无机填料微粒，以增强多层薄膜的性能。共挤多层聚酰亚胺薄膜可用于形成单层和双层聚酰亚胺金属包覆层压板，用于柔性电路应用。