Bis-<4-vinyloxy-phenyl>-methan | 36373-79-2

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: Bis-<4-vinyloxy-phenyl>-methan
• 英文别名: 1,1'-Methylenebis[4-(ethenyloxy)benzene]；1-ethenoxy-4-[(4-ethenoxyphenyl)methyl]benzene
• CAS: 36373-79-2
• 化学式: C₁₇H₁₆O₂
• 分子量: 252.313
• InChiKey: MTIRZDOTJROEJA-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4.8
• 重原子数：
  19
• 可旋转键数：
  6
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.06
• 拓扑面积：
  18.5
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• Photosensitive compositions based on polycyclic polymers for low stress, high temperature films
  申请人：Elce Edmund

  公开号：US20060020068A1

  公开（公告）日：2006-01-26

  Vinyl addition polymer compositions, methods for forming such compositions, methods for using such compositions to form microelectronic and optoelectronic devices are provided. The vinyl addition polymer encompassed by such compositions has a polymer backbone having two or more distinct types of repeat units derived from norbornene-type monomers independently selected from monomers of Formula I: wherein each of X, m, R 1 , R 2 , R 3 , and R 4 is as defined herein and wherein a first type of repeat unit is derived from a glycidyl ether substituted norbornene monomer and a second type of repeat unit is derived from an aralkyl substituted norbornene monomer.

  本发明提供了乙烯基加成聚合物组合物、形成此类组合物的方法、使用此类组合物形成微电子和光电器件的方法。此类组合物所包含的乙烯基加成聚合物具有聚合物骨架，该聚合物骨架具有两种或两种以上不同类型的重复单元，这些重复单元衍生自降冰片烯类单体，这些单体独立地选自式 I 的单体： 其中X、m、R 1 , R 2 , R 3 和 R 4 如本文所定义，其中第一类重复单元来自缩水甘油醚取代的降冰片烯单体，第二类重复单元来自芳基取代的降冰片烯单体。
• PHOTOSENSITIVE COMPOSITIONS BASED ON POLYCYCLIC POLYMERS
  申请人：SUMITOMO BAKELITE CO., LTD.

  公开号：EP1532486A1

  公开（公告）日：2005-05-25
• METHODS AND MATERIALS USEFUL FOR CHIP STACKING, CHIP AND WAFER BONDING
  申请人：Promerus LLC

  公开号：EP1997138A2

  公开（公告）日：2008-12-03
• Photosensitive compositions based on polycyclic polymers
  申请人：——

  公开号：US20040039153A1

  公开（公告）日：2004-02-26

  A copolymer composition including a copolymer having repeat units of structural formula I: 1 where X is selected from O, —CH 2 —, and —CH 2 —CH 2 —; m is an integer from 0 to 5; and each occurrence of R 1 -R 4 are independently selected from H; C 1 to C 25 linear, branched, and cyclic alkyl, aryl, aralkyl, alkaryl, alkenyl and alkynyl that can include one or more hetero atoms selected from O, N, and Si; a group that contains an epoxy functionality; —(CH 2 ) n C(O)OR 5 ; —(CH 2 ) n C(O)OR 6 ; —(CH 2 ) n OR 6 ; —(CH 2 ) n OC(O)R 6 ; —(CH 2 ) n C(O)R 6 ; —(CH 2 ) n OC(O)OR 6 ; and any combination of two of R 1 , R 2 , R 3 , and R 4 linked together by a linking group. A portion of the repeat units having structural formula I contain at least one epoxy functional pendant group. The copolymer composition can be included with a material that photonically forms a catalyst in a photodefinable dielectric composition, which can be used to form a photodefinable layer on a substrate.
• Methods and materials useful for chip stacking, chip and wafer bonding
  申请人：Apanius Chris

  公开号：US20070232026A1

  公开（公告）日：2007-10-04

  Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.