biphenyl-2,3,4'-tricarboxylic acid

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: biphenyl-2,3,4'-tricarboxylic acid
• 英文别名: Biphenyl-2,3,4'-tricarbonsaeure；3-(4-Carboxyphenyl)phthalic acid
• 化学式: C₁₅H₁₀O₆
• 分子量: 286.241
• InChiKey: AVCAXBWAGWKQRY-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.1
• 重原子数：
  21
• 可旋转键数：
  4
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  112
• 氢给体数：
  3
• 氢受体数：
  6

反应信息

• 作为产物：
  描述：

  2,3-diethyl 4'-methyl [1,1'-biphenyl]-2,3,4'-tricarboxylate 在 水 、 sodium hydroxide 、 盐酸 作用下， 以 1,4-二氧六环 、 水 为溶剂， 以27%的产率得到biphenyl-2,3,4'-tricarboxylic acid
  参考文献：
  名称：

  邻苯二甲酸衍生物的金属β-内酰胺酶抑制活性

  摘要：

  4-丁基-3-甲基邻苯二甲酸被认为是金属β-内酰胺酶抑制剂。取代邻苯二甲酸的结构-活性关系研究提供了3-苯基邻苯二甲酸衍生物作为有效的IMP-1抑制剂。另一方面，用4-羟基苯基邻苯二甲酸衍生物进行的3-取代显示出与比安培南（BIPM）对产生IMP-1的铜绿假单胞菌的有效组合作用。

  DOI：

  10.1016/j.bmcl.2009.07.018

文献信息

• Suzuki cross-coupling reactions using reverse-phase glass beads in aqueous media
  作者：Kokovi M. Lawson Daku、Roger F. Newton、Simon P. Pearce、Julia Vile、Jonathan M.J. Williams

  DOI：10.1016/s0040-4039(03)01128-6

  日期：2003.6

  Reverse-phase glass beads have been employed in Suzuki reactions to provide, in aqueous media, a route to diverse polar substrates in good yield and with low levels of palladium leaching. (C) 2003 Elsevier Science Ltd. All rights reserved.
• Yabuta et al., Nippon Nogeikagaku Kaishi, 1941, vol. 17, p. 975,980
  作者：Yabuta et al.

  DOI：——

  日期：——
• MULTILAYER CONDUCTIVE FILM, CURRENT COLLECTOR USING SAME, BATTERY AND BIPOLAR BATTERY
  申请人：Kaneka Corporation

  公开号：EP2716448B1

  公开（公告）日：2018-10-17
• Adhesive film, lead frame with adhesive film, and semiconductor device using same
  申请人：Matsuura Hidekazu

  公开号：US20050255278A1

  公开（公告）日：2005-11-17

  The present invention provides an adhesive film that combines low temperature adhesion with favorable wire bonding characteristics. The adhesive film used for bonding a semiconductor element to a target adherend comprises an adhesive layer formed on one surface, or both surfaces, of a heat resistant film, the adhesive layer comprises a resin A and a resin B, a glass transition temperature of the resin A is lower than a glass transition temperature of the resin B, and the adhesive layer has a sea-island structure, in which the resin A forms the sea, and the resin B forms the islands.
• THERMOPLASTIC RESIN COMPOSITION FOR SEMICONDUCTOR, ADHESION FILM, LEAD FRAME, AND SEMICONDUCTOR DEVICE USING THE SAME, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE
  申请人：Tateoka Kiyohide

  公开号：US20090091012A1

  公开（公告）日：2009-04-09

  The object of the present invention is to provide an adhesion film for semiconductor that is capable of bonding a semiconductor chip to a lead frame tightly at an adhesion temperature lower than that of the adhesion film of a traditional polyimide resin without generation of voids and that can also be used for protection of lead frame-exposed area, a thermoplastic resin composition for semiconductor for use in the adhesive agent layer therein, and a lead frame having the adhesive film and a semiconductor device; and, to achieve the object, the present invention provides a thermoplastic resin composition for semiconductor, comprising a thermoplastic resin obtained in reaction of an amine component containing an aromatic diamine mixture (A) containing 1,3-bis(3-aminophenoxy)benzene, 3-(3′-(3″-aminophenoxy)phenyl)amino-1-(3′-(3″-aminophenoxy)phenoxy)benzene and 3,3′-bis(3″-aminophenoxy)diphenylether, and an acid component (C), an adhesion film for semiconductor using the same, a lead frame having the adhesion film and a semiconductor device using the same.