Disclosed is a semiconductor device having a wafer level package structure which is characterized by containing a resin layer composed of a resin composition which is curable at 250°C or less. Such a semiconductor device having a wafer level package structure is excellent in low stress properties, solvent resistance, low water absorbency, electrical insulation properties, adhesiveness and the like.
本发明公开了一种具有晶圆级封装结构的半导体器件,其特点是含有由可在 250°C 或更低温度下固化的
树脂组合物构成的
树脂层。这种具有晶圆级封装结构的半导体器件在低应力特性、耐溶剂性、低吸
水性、电绝缘特性、粘合性等方面都非常出色。