An organosilicon-modified charge transporting compound having a structure represented by the following Formula (I):
wherein A represents a charge transporting group, Q represents a hydrolytic group or a hydroxyl group, R2 represents a monovalent hydrocarbon group or a halogen-substituted monovalent hydrocarbon group having 1 to 15 carbon atoms, n is 1 to 18, m is 1 to 3, and 1 is 1 to 5; and a curable composition containing the organosilicon-modified charge transporting compound and a cure type resin chiefly composed of an organosilicon high polymer.
一种有机
硅修饰的电荷传输化合物,其结构由以下公式(I)表示:其中A表示电荷传输基团,Q表示
水解基团或羟基,R2表示具有1至15个碳原子的单价碳氢基团或卤素取代的单价碳氢基团,n为1至18,m为1至3,1为1至5;以及包含有机
硅修饰的电荷传输化合物和主要由有机
硅高聚物组成的固化型
树脂的可固化组合物。