POLYIMIDE PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, A SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING POLYIMIDE PRECURSOR COMPOSITION
申请人:FUJIFILM Corporation
公开号:US20180079864A1
公开(公告)日:2018-03-22
Provided are a photosensitive resin composition using a polyimide precursor composition, a cured film, a method for producing a cured film, a semiconductor device, and a method for producing a polyimide precursor composition.
A polyimide precursor composition in which the molar ratio of repeating units represented by General Formula (1-2) among structural isomers of the polyimide precursor is 60% to 90% by mole; in General Formula (1-2), A
1
and A
2
each independently represent an oxygen atom or NH, R
111
and R
112
each independently represent a single bond or a divalent organic group, and R
113
and R
114
each independently represent a hydrogen atom or a monovalent organic group.