4-(1,1-dimethylethyl)-N-methylphthalimide

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 异吲哚及其衍生物
• 英文名称: 4-(1,1-dimethylethyl)-N-methylphthalimide
• 英文别名: 5-(tert-butyl)-2-methylisoindoline-1,3-dione；5-tert-Butyl-2-methyl-isoindolin-1,3-dion；5-Tert-butyl-2-methylisoindole-1,3-dione
• 化学式: C₁₃H₁₅NO₂
• 分子量: 217.268
• InChiKey: MPIAHMBDXGBGDO-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3
• 重原子数：
  16
• 可旋转键数：
  1
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.38
• 拓扑面积：
  37.4
• 氢给体数：
  0
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  4-叔丁基邻二甲苯 在 吡啶 、 potassium permanganate 、 水 作用下， 生成 4-(1,1-dimethylethyl)-N-methylphthalimide
  参考文献：
  名称：

  123.新的中间体和染料。第二部分 4-叔丁基邻苯二甲酸酐的制备及性能。缩合物与苯类烃的取向

  摘要：

  DOI：

  10.1039/jr9520000680

文献信息

• Homolytic Base-Promoted Aromatic Alkylations by Alkylmercury Halides¹
  作者：Glen A. Russell、Ping Chen、Byeong Hyo Kim、Ragine Rajaratnam

  DOI：10.1021/ja971809n

  日期：1997.9.1

  Electron transfer chain reactions leading to substitution in electronegatively substituted benzene derivatives can be observed with alkylmercury halides in the presence of proton acceptors such as ...

  在质子受体的存在下，可以用烷基汞卤化物观察到导致电负性取代的苯衍生物取代的电子转移链反应，例如……
• CHROMAN DERIVATIVES AS TRPM8 INHIBITORS
  申请人：AMGEN INC.

  公开号：US20140045855A1

  公开（公告）日：2014-02-13

  Chroman compounds and derivatives of Formula I are useful inhibitors of TRPM8. Such compounds are useful in treating a number of TRPM8 mediated disorders and conditions and may be used to prepare medicaments and pharmaceutical compositions useful for treating such disorders and conditions. Examples of such disorders include, but are not limited to, migraines and neuropathic pain. Compounds of Formula I have the following structure: where the definitions of the variables are provided herein.

  Formula I的Chroman化合物和衍生物是TRPM8的有用抑制剂。这些化合物在治疗多种由TRPM8介导的疾病和症状方面具有用途，并可用于制备治疗这些疾病和症状的药物和药物组合物。这些疾病的例子包括，但不限于，偏头痛和神经病性疼痛。Formula I的化合物具有以下结构：变量的定义在此提供。
• TRPM8 ANTAGONISTS AND THEIR USE IN TREATMENTS
  申请人：Biswas Kaustav

  公开号：US20130157996A1

  公开（公告）日：2013-06-20

  Compounds of Formula I are useful as antagonists of TRPM8. Such compounds are useful in treating a number of TRPM8 mediated disorders and conditions and may be used to prepare medicaments and pharmaceutical compositions useful for treating such disorders and conditions. Examples of such disorders include, but are not limited to, migraines and neuropathic pain. Compounds of Formula I have the following structure: where the definitions of the variables are provided herein.

  公式I的化合物可用作TRPM8的拮抗剂。这些化合物在治疗许多TRPM8介导的疾病和病症方面非常有用，并可用于制备用于治疗此类疾病和病症的药物和制剂。此类疾病的示例包括但不限于偏头痛和神经病性疼痛。公式I的化合物具有以下结构：其中变量的定义在此提供。
• Salicylaldehyde as an SET-HAT Bifunctional Photocatalyst for the Intermolecular Transalkylation of Phthalimide
  作者：Bin-Hong Han、Yu Sun、Xian-Peng Cai、Jian-Ping Qu、Yan-Biao Kang

  DOI：10.1021/acs.joc.3c01141

  日期：2023.9.15

  Salicylaldehyde works as an efficient photocatalyst for the intermolecular transalkylation of phthalimide. The well-designed dimethyl N-hydroxyphthalimide ester proves to be a good alkylation reagent. It inhibits the competing intramolecular alkylation of alkylating reagent, enabling the site-specific synthesis of N-substituted phthalimide.

  水杨醛是邻苯二甲酰亚胺分子间烷基转移的有效光催化剂。精心设计的N-羟基邻苯二甲酰亚胺二甲酯酯被证明是一种良好的烷基化试剂。它抑制烷基化试剂的竞争性分子内烷基化，从而实现N-取代邻苯二甲酰亚胺的位点特异性合成。
• Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin composition
  申请人：TORAY INDUSTRIES, INC.

  公开号：US10177022B2

  公开（公告）日：2019-01-08

  The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol % of the (A1) residue and 0.01-60 mol % of the (B1) residue.

  本发明提供了一种具有优异耐热性的临时粘接剂，据此可通过单一类型的粘接剂层粘接半导体电路形成基板和支撑基板，其粘接力在制造半导体器件或类似物的步骤过程中不会发生变化，并且该粘接剂随后可在室温温和条件下轻松脱粘；以及一种使用该临时粘接剂制造半导体器件的方法。本发明包括一种临时粘合粘合剂，其中聚酰亚胺共聚物至少具有酸二酐残基和二胺残基，二胺残基包括(A1)由通式(1)表示的聚硅氧烷基二胺残基（其中n为1至15的自然数）和(B1)由通式(1)表示的聚硅氧烷基二胺残基（其中n为16至100的自然数）中的两种，聚酰亚胺共聚物含有40-99.99摩尔%的(A1)残余物和0.01-60摩尔%的(B1)残余物。