申请人:LEE WAI MUN
公开号:US20110146724A1
公开(公告)日:2011-06-23
The present invention discloses a photoresist stripper for removing positive and negative tone photoresist, bonding adhesive, ink mark and post etch residue etc. from semiconductor substrates. The photoresist stripper comprises:
a) one or more organic sulfonic acids with a structure of
where R can be alkyl, substituted alkyl, aryl, substituted aryl and alkylaryl, and n is 1 or higher; and
b) one or more alkanolamine; one or more alkanolamine with the structure of
wherein R1 and R2 can be H, alkyl, aryl, alkylaryl, arylalkyl, alkyl alcohol, aryl alcohol, alkyaryl alcohol or arylalkyl alcohol and R3 is alkyl alcohol, aryl alcohol, alkyaryl alcohol or arylalkyl alcohol or the like.
c) Optionally, one or more halogen free organic solvents.
d) Optionally, one or more corrosion inhibitors
Optionally, the photoresist stripper further comprises other surfactants.