十六烷基苯氧基苯 | 68459-89-2

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 中文名称: 十六烷基苯氧基苯
• 英文名称: Palmitylphenoxybenzene
• 英文别名: 1-hexadecyl-4-phenoxybenzene
• CAS: 68459-89-2
• 化学式: C₂₈H₄₂O
• 分子量: 394.6
• InChiKey: WXHGASSSHSIGJY-UHFFFAOYSA-N

物化性质

• 物理描述：
  Liquid

计算性质

• 辛醇/水分配系数(LogP)：
  11.6
• 重原子数：
  29
• 可旋转键数：
  17
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.57
• 拓扑面积：
  9.2
• 氢给体数：
  0
• 氢受体数：
  1

文献信息

• POLISHING LIQUID AND POLISHING METHOD
  申请人：FUJIFILM Corporation

  公开号：US20150072525A1

  公开（公告）日：2015-03-12

  A method for chemical mechanical polishing of a body to be polished in a planarization process for manufacturing of a semiconductor integrated circuit. The body to be polished including at least a first layer containing polysilicon or modified polysilicon and a second layer containing at least one selected from the group consisting of silicon oxide, silicon nitride, silicon carbide, silicon carbonitride, silicon oxycarbide, and silicon oxynitride. The method including supplying a polishing liquid to a polishing pad on a polishing platen, rotating the polishing platen, and thereby causing relative motion of the polishing pad and a surface to be polished of the body to be polished while in contact with each other for carrying out selective polishing of the second layer with respect to the first layer, and the polishing liquid including a colloidal silica particles, an organic acid, and an anionic surfactant.