4-ethoxy-2,6-dimethylphenol

• 分子结构分类: 有机化合物 - 苯类化合物 - 酚类
• 英文名称: 4-ethoxy-2,6-dimethylphenol
• 化学式: C₁₀H₁₄O₂
• 分子量: 166.22
• InChiKey: SOICEALYGNLUAH-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.7
• 重原子数：
  12
• 可旋转键数：
  2
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.4
• 拓扑面积：
  29.5
• 氢给体数：
  1
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  2,6-二甲基-2,5-环己二烯-1,4-二酮 在 sodium dithionite 、 硫酸 、 sodium hydride 、 potassium hydroxide 、 sodium hydroxide 作用下， 以 甲醇 、 乙醚 、 乙醇 、 二氯甲烷 、 水 、 mineral oil 为溶剂， 反应 12.37h， 生成 4-ethoxy-2,6-dimethylphenol
  参考文献：
  名称：

  三组分不对称催化 Ugi 反应——通过底物介导的催化剂组装实现多样性的一致性

  摘要：

  通过筛选大量不同的 BOROX 催化剂，确定了用于三组分 Ugi 反应的第一种手性催化剂。BOROX 催化剂由手性联芳基配体、胺、水、BH 3 ⋅SMe 2 和醇或苯酚原位组装而成。催化剂筛选包括 13 种不同的配体、12 种胺和 47 种醇或酚。最佳催化剂体系 (LAP 8-5-47) 提供了来自醛、仲胺和异腈的 α-氨基酰胺，具有出色的不对称诱导能力。催化活性物质被认为是由手性硼酸阴离子和亚胺阳离子组成的离子对。

  DOI：

  10.1002/anie.201310491

文献信息

• 一种4-取代-2，6-二甲基苯酚的工艺制备方法
  申请人：成都泰蓉生物科技有限公司

  公开号：CN109942376A

  公开（公告）日：2019-06-28

  本发明公开了一种4‑取代‑2，6‑二甲基苯酚的工艺制备方法，本发明制备方法通过优化改进制备路线方法，优化反应条件，改善后处理及纯化方法，降低了操作危险等级和生产成本；对反应用容器设备的抗腐蚀等级要求低，操作安全性好，后处理绿色环保，得到的4‑取代‑2，6‑二甲基苯酚杂质含量低，在提高收率的同时大大提高了中间体产品的纯度和质量，改善后续原料药产品生产过程中工艺控制的难度和提高后续原料药产品质量和合格率；此制备方法各步骤操作简单，溶剂及工艺条件安全易得，可实现了环保绿色生产，具有广阔的应用前景。
• Reductive-alkylation and aromatic coupling reactions of 1,4-benzoquinone derivatives promoted by ethylaluminum dichloride
  作者：Vitor F Ferreira、Francis J Schmitz

  DOI：10.1016/s0022-328x(98)00865-1

  日期：1998.11

  Reactions of several substituted 1,4-benzoquinones with ethylaluminum dichloride in dichloromethane were studied. It was found that some quinones undergo a new radical aromatic coupling under these conditions, while others undergo a 1,6-reductive O-alkylation.

  研究了几种取代的1,4-苯醌与二氯化乙基铝在二氯甲烷中的反应。发现在这些条件下一些醌进行新的自由基芳族偶联，而另一些进行1，6-还原O-烷基化。
• POLYMERIZABLE COMPOSITION, THERMOPLASTIC RESIN COMPOSITION, CROSSLINKED RESIN, AND CROSSLINKED RESIN COMPOSITE MATERIALS
  申请人：ZEON CORPORATION

  公开号：EP1589054A1

  公开（公告）日：2005-10-26

  A polymerizable composition which comprises (i) a cycloolefin monomer, (ii) a metathesis polymerization catalyst, (iii) a chain transfer agent, (iv) a radical crosslinking agent, and (v) a compound (α) selected from the group consisting of compounds having alkoxyphenol structures wherein each aromatic ring has one or more substituents, compounds having aryloxyphenol structures, and compounds having catechol structures wherein each aromatic ring has two or more substituents; a thermoplastic resin composition which comprises (1) a cycloolefin thermoplastic resin, (2) a radical crosslinking agent, and (3) a compound (α) ; a process for the production thereof; a crosslinked resin obtained by crosslinking the thermoplastic resin composition; and crosslinked resin composite materials produced by laminating a substrate with the thermoplastic resin composition and crosslinking the thermoplastic resin composition. The invention provides a polymerizable composition useful as raw material in the production of a thermoplastic resin composition excellent in storage stability and fluidity in heat lamination; a thermoplastic resin composition and a process for the production thereof; a crosslinked resin obtained by crosslinking the thermoplastic resin composition; and crosslinked resin composite materials exhibiting excellent interlayer adhesion.

  一种可聚合组合物，它包括(i)环烯烃单体，(ii)偏聚催化剂，(iii)链转移剂，(iv)自由基交联剂，和(v)选自以下组别的化合物(α)：具有烷氧基苯酚结构的化合物，其中每个芳香环有一个或多个取代基；具有芳氧基苯酚结构的化合物；以及具有邻苯二酚结构的化合物，其中每个芳香环有两个或多个取代基；一种热塑性树脂组合物，它包括：(1) 环烯烃热塑性树脂；(2) 自由基交联剂；(3) 化合物 (α)；其生产工艺；通过交联该热塑性树脂组合物而获得的交联树脂；以及通过将基材与该热塑性树脂组合物层压并交联该热塑性树脂组合物而生产的交联树脂复合材料。本发明提供了一种可聚合组合物，可作为生产热塑性树脂组合物的原料，该组合物具有优异的储存稳定性和热层压流动性；一种热塑性树脂组合物及其生产工艺；一种通过交联该热塑性树脂组合物而获得的交联树脂；以及具有优异层间粘合性的交联树脂复合材料。
• ORGANIC SEMICONDUCTOR COMPOSITION, ORGANIC THIN-FILM TRANSISTOR, ELECTRONIC PAPER, AND DISPLAY DEVICE
  申请人：Fujifilm Corporation

  公开号：EP3001472A1

  公开（公告）日：2016-03-30

  The present invention provides an organic semiconductor composition, which improves the insulation reliability of an organic thin-film transistor without greatly reducing the mobility of the organic thin-film transistor, an organic thin-film transistor which is formed by using the organic semiconductor composition, and electronic paper and a display device which use the organic thin-film transistor. The organic semiconductor composition of the present invention contains an organic semiconductor material and an F-containing migration inhibitor selected from the group consisting of a compound represented by any of Formulae (1) to (8), a polymer compound (X) containing a repeating unit represented by Formula (A), and a polymer compound (Y) containing a repeating unit represented by Formula (B) and a repeating unit represented by Formula (C).

  本发明提供了一种有机半导体组合物，它能在不大大降低有机薄膜晶体管的迁移率的情况下提高有机薄膜晶体管的绝缘可靠性；提供了一种使用该有机半导体组合物形成的有机薄膜晶体管；还提供了使用该有机薄膜晶体管的电子纸和显示装置。本发明的有机半导体组合物含有一种有机半导体材料和一种含 F 的迁移抑制剂，该迁移抑制剂选自由式（1）至（8）中任一式所代表的化合物、含有式（A）所代表的重复单元的聚合物化合物（X）和含有式（B）所代表的重复单元和式（C）所代表的重复单元的聚合物化合物（Y）组成的组。
• Polymerizable Composition, Thermoplastic Resin Composition, Crosslinked Resin, And Crosslinked Resin Composite Materials
  申请人：Sugawara Tomoo

  公开号：US20080125531A1

  公开（公告）日：2008-05-29

  A polymerizable composition which comprises (i) a cycloolefin monomer, (ii) a metathesis polymerization catalyst, (iii) a chain transfer agent, (iv) a radical crosslinking agent, and (v) a compound (α) selected from the group consisting of compounds having alkoxyphenol structures wherein each aromatic ring has one or more substituents, compounds having aryloxyphenol structures, and compounds having catechol structures wherein each aromatic ring has two or more substituents; a thermoplastic resin composition which comprises (1) a cycloolefin thermoplastic resin, (2) a radical crosslinking agent, and (3) a compound (α); a process for the production thereof; a crosslinked resin obtained by crosslinking the thermoplastic resin composition; and crosslinked resin composite materials produced by laminating a substrate with the thermoplastic resin composition and crosslinking the thermoplastic resin composition. The invention provides a polymerizable composition useful as raw material in the production of a thermoplastic resin composition excellent in storage stability and fluidity in heat lamination; a thermoplastic resin composition and a process for the production thereof; a crosslinked resin obtained by crosslinking the thermoplastic resin composition; and crosslinked resin composite materials exhibiting excellent interlayer adhesion.