1-(4-carboxyphenyl)-3-methylpyrrolidine-2,5-dione

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 1-(4-carboxyphenyl)-3-methylpyrrolidine-2,5-dione
• 英文别名: 4-(3-Methyl-2,5-dioxo-pyrrolidin-1-yl)-benzoic acid；4-(3-methyl-2,5-dioxopyrrolidin-1-yl)benzoic acid
• 化学式: C₁₂H₁₁NO₄
• 分子量: 233.224
• InChiKey: NGTUAZVXHJBAKJ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.8
• 重原子数：
  17
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.25
• 拓扑面积：
  74.7
• 氢给体数：
  1
• 氢受体数：
  4

反应信息

• 作为产物：
  描述：

  甲基丁二酸 、 对氨基苯甲酸 以 neat (no solvent) 为溶剂， 反应 3.0h， 以40%的产率得到1-(4-carboxyphenyl)-3-methylpyrrolidine-2,5-dione
  参考文献：
  名称：

  新型1-芳基-3-甲基琥珀酰亚胺结构-性能关系的实验和理论研究

  摘要：

  摘要 合成了一系列 10 种 1-芳基-3-甲基琥珀酰亚胺，并在一组 15 种二元溶剂混合物中研究了它们的溶剂致变色性能。根据 Kamlet 和 Taft 提出的线性溶剂化能关系 (LSER) 概念分析溶质-溶剂相互作用。使用简单的哈米特方程分析取代基对 UV-Vis 吸收和 NMR 光谱的电子效应。此外，根据对这些化​​合物获得的实验吸收最大值的位置，已经评估了使用 6-311G(d,p) 基本组的 B3LYP、CAM-B3LYP 和 M06-2X 泛函。还评估了集成网格效应。给出了通过分子骨架的取代基效应传输以及基于量子化学计算的 HOMO 和 LUMO 轨道的性质的解释。使用 B3LYP、CAM-B3LYP 和 M06-2X 方法生成了来自原子极性张量 (APT)、自然布居分析 (NBO) 和适合静电势的电荷的部分原子电荷值，并与不同的实验性质相关联. 为了估计分子的化学活性，计算了

  DOI：

  10.1016/j.molstruc.2016.09.086

文献信息

• Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin composition
  申请人：TORAY INDUSTRIES, INC.

  公开号：US10177022B2

  公开（公告）日：2019-01-08

  The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol % of the (A1) residue and 0.01-60 mol % of the (B1) residue.

  本发明提供了一种具有优异耐热性的临时粘接剂，据此可通过单一类型的粘接剂层粘接半导体电路形成基板和支撑基板，其粘接力在制造半导体器件或类似物的步骤过程中不会发生变化，并且该粘接剂随后可在室温温和条件下轻松脱粘；以及一种使用该临时粘接剂制造半导体器件的方法。本发明包括一种临时粘合粘合剂，其中聚酰亚胺共聚物至少具有酸二酐残基和二胺残基，二胺残基包括(A1)由通式(1)表示的聚硅氧烷基二胺残基（其中n为1至15的自然数）和(B1)由通式(1)表示的聚硅氧烷基二胺残基（其中n为16至100的自然数）中的两种，聚酰亚胺共聚物含有40-99.99摩尔%的(A1)残余物和0.01-60摩尔%的(B1)残余物。
• Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin compostion
  申请人：Toray Industries, Inc.

  公开号：US10941320B2

  公开（公告）日：2021-03-09

  The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol % of the (A1) residue and 0.01-60 mol % of the (B1) residue.

  本发明提供了一种具有优异耐热性的临时粘接剂，据此可通过单一类型的粘接剂层粘接半导体电路形成基板和支撑基板，其粘接力在制造半导体器件或类似物的步骤过程中不会发生变化，并且该粘接剂随后可在室温温和条件下轻松脱粘；以及一种使用该临时粘接剂制造半导体器件的方法。本发明包括一种临时粘合粘合剂，其中聚酰亚胺共聚物至少具有酸二酐残基和二胺残基，二胺残基包括(A1)由通式(1)表示的聚硅氧烷基二胺残基（其中n为1至15的自然数）和(B1)由通式(1)表示的聚硅氧烷基二胺残基（其中n为16至100的自然数）中的两种，聚酰亚胺共聚物含有40-99.99摩尔%的(A1)残余物和0.01-60摩尔%的(B1)残余物。
• ADHESIVE FOR TEMPORARY BONDING, ADHESIVE LAYER, WAFER WORK PIECE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME, REWORK SOLVENT, POLYIMIDE COPOLYMER, POLYIMIDE MIXED RESIN, AND RESIN COMPOSITION (AS AMENDED)
  申请人：TORAY INDUSTRIES, INC.

  公开号：US20170221746A1

  公开（公告）日：2017-08-03

  The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol % of the (A1) residue and 0.01-60 mol % of the (B1) residue.
• ADHESIVE FOR TEMPORARY BONDING, ADHESIVE LAYER, WAFER WORK PIECE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME, REWORK SOLVENT, POLYIMIDE COPOLYMER, POLYIMIDE MIXED RESIN, AND RESIN COMPOSTION
  申请人：Toray Industries, Inc.

  公开号：US20190080952A1

  公开（公告）日：2019-03-14

  The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol % of the (A1) residue and 0.01-60 mol % of the (B1) residue.
• Experimental and theoretical study on the structure-property relationship of novel 1-aryl-3-methylsuccinimides
  作者：Nebojša R. Banjac、Bojan Đ. Božić、Jelena M. Mirković、Vesna D. Vitnik、Željko J. Vitnik、Nataša V. Valentić、Gordana S. Ušćumlić

  DOI：10.1016/j.molstruc.2016.09.086

  日期：2017.2

  the substituents on the UV–Vis absorption and NMR spectra was analyzed using the simple Hammett equation. Moreover, the B3LYP, CAM-B3LYP, and M06-2X functionals using the 6–311G(d,p) basic set have been assessed in light of the position of experimental absorption maxima obtained for these compounds. The integration grid effects have also been evaluated. An interpretation of the substituent-effect transmission

  摘要 合成了一系列 10 种 1-芳基-3-甲基琥珀酰亚胺，并在一组 15 种二元溶剂混合物中研究了它们的溶剂致变色性能。根据 Kamlet 和 Taft 提出的线性溶剂化能关系 (LSER) 概念分析溶质-溶剂相互作用。使用简单的哈米特方程分析取代基对 UV-Vis 吸收和 NMR 光谱的电子效应。此外，根据对这些化​​合物获得的实验吸收最大值的位置，已经评估了使用 6-311G(d,p) 基本组的 B3LYP、CAM-B3LYP 和 M06-2X 泛函。还评估了集成网格效应。给出了通过分子骨架的取代基效应传输以及基于量子化学计算的 HOMO 和 LUMO 轨道的性质的解释。使用 B3LYP、CAM-B3LYP 和 M06-2X 方法生成了来自原子极性张量 (APT)、自然布居分析 (NBO) 和适合静电势的电荷的部分原子电荷值，并与不同的实验性质相关联. 为了估计分子的化学活性，计算了