Provided is a curable composition containing a reactive mixture of components including an polyethersulfone having a chemical group reactive with an epoxide, a cycloaliphatic polyepoxide resin, a polyepoxide having a functionality greater than two, a liquid diepoxide resin, a first curative containing 9,9-bis(aminophenyl)fluorene or a derivative therefrom and having a curing onset temperature of from 150° C. to 200° C. The components can further comprise a second curative having a curing onset temperature of from 60° C. to 180° C. When thermally curing this composition, the second epoxy curative starts to cure before the first epoxy curative, thereby inhibiting vertical flow of the adhesive during the curing process.
本发明提供了一种可固化组合物,该组合物含有一种反应性混合物,其组分包括具有与
环氧化物反应的
化学基团的聚醚砜、环脂族聚
环氧化物树脂、官能度大于 2 的聚
环氧化物、液态二
环氧化物树脂、含有 9,9-双(
氨基苯基)
芴或其衍
生物且固化起始温度为 150 摄氏度至 200 摄氏度的第一固化剂。热固化该组合物时,第二环氧固化剂在第一环氧固化剂之前开始固化,从而在固化过程中抑制粘合剂的垂直流动。