The present disclosure provides a two component releasable thermal gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The two component releasable thermal gel is mixed before the point of application and facilitates catalytic cross-linking. The thermal gel includes a first component including a primary silicone oil, an inhibitor, a catalyst, and at least one thermally conductive filler, and a second component including a primary silicone oil, a cross linking silicone oil, and at least one thermally conductive filler, wherein the ratio of total content of Si—H groups to total content of vinyl groups in the thermal gel is between 0.03 to 10. The thermal gel is releasable from a substrate upon which the thermal gel is applied.
本公开提供了一种双组分可释放导热凝胶,可用于将发热电子设备(如计算机芯片)的热量传递到散热结构(如散热器和散热片)。双组分可释放导热凝胶在使用前进行混合,有利于催化交联。导热凝胶包括第一种成分,包括初级
硅油、
抑制剂、催化剂和至少一种导热填料;以及第二种成分,包括初级
硅油、交联
硅油和至少一种导热填料,其中导热凝胶中 Si-H 基团的总含量与
乙烯基团的总含量之比介于 0.03 至 10 之间。导热凝胶可从涂有导热凝胶的基材上释放。