1,1'-[亚甲基二(2-乙基-4,1-亚苯基)]二-1H-吡咯-2,5-二酮 | 58978-10-2

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 中文名称: 1,1'-[亚甲基二(2-乙基-4,1-亚苯基)]二-1H-吡咯-2,5-二酮
• 英文名称: 1,1'-(Methylenebis(2-ethyl-4,1-phenylene))bis-1H-pyrrole-2,5-dione
• 英文别名: 1-[4-[[4-(2,5-dioxopyrrol-1-yl)-3-ethylphenyl]methyl]-2-ethylphenyl]pyrrole-2,5-dione
• CAS: 58978-10-2
• 化学式: C₂₅H₂₂N₂O₄
• 分子量: 414.5
• InChiKey: MZXBGQAYUVYKAL-UHFFFAOYSA-N

物化性质

• 沸点：
  610.8±55.0 °C(Predicted)
• 密度：
  1.311±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  3.7
• 重原子数：
  31
• 可旋转键数：
  6
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.2
• 拓扑面积：
  74.8
• 氢给体数：
  0
• 氢受体数：
  4

文献信息

• METHOD OF PRODUCING POLYMER
  申请人：Japan as represented by President of Shizuoka University

  公开号：EP1598374A1

  公开（公告）日：2005-11-23

  A method of producing a polymer according to the present invention is characterized by comprising a step of photopolymerizing one or more photopolymerizable polymerization precursors by irradiation with an activation energy ray in a supercritical fluid or in a subcritical fluid.

  根据本发明生产聚合物的方法，其特征在于包括在超临界流体或亚临界流体中用活化能射线照射一种或多种可光聚合的聚合前体使其光聚合的步骤。
• POLYMER AND PROCESS FOR PRODUCING POLYMER
  申请人：KANSAI PAINT CO., LTD.

  公开号：EP1698647A1

  公开（公告）日：2006-09-06

  A process for producing a polymer, characterized in that a polymer having juts is produced by carrying out photopolymerization of at least one photopolymerizable polymerization precursor containing a photocurable compound having two or more unsaturated bonds by irradiation with active energy ray, optionally in the presence of at least one additive component for adding a polymer function, in a supercritical fluid or subcritical fluid; and a polymer having juts of 10 nm or more height, which height is 0.1-fold or more of the diameter of the juts, produced by the above process.

  一种生产聚合物的工艺，其特征在于：在超临界流体或亚临界流体中，通过活性能量射线照射至少一种含有具有两个或两个以上不饱和键的可光化化合物的可光化聚合前体，并可选择在至少一种用于增加聚合物功能的添加剂成分存在的情况下，对其进行光聚合反应，从而生产出具有突起的聚合物；以及通过上述工艺生产出具有 10 纳米或更高突起的聚合物，其突起高度为突起直径的 0.1 倍或更高。
• PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP2141198A1

  公开（公告）日：2010-01-06

  Provided is a process for producing a thermosetting resin varnish from which a printed circuit board can be produced wherein the printed circuit board has excellent dielectric properties in a high frequency band and can significantly reduce the transmission loss, and exhibits excellent heat resistance after moisture absorption and excellent thermal expansion properties and satisfies the metallic foil peeling strength. A process for producing a thermosetting resin varnish containing a thermosetting resin composition, which contains an uncured semi-IPN composite, an inorganic filler, and a saturated thermoplastic elastomer, wherein the process comprises the steps of: (i) preliminary reacting (B) a butadiene polymer which contains in the molecule thereof 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in the side chain thereof, and which is not chemically modified and (C) a crosslinking agent, in the presence of (A) a polyphenylene ether to obtain a polyphenylene ether-modified butadiene prepolymer which is an uncured semi-IPN composite; (ii) mixing together (D) an inorganic filler and (E) a saturated thermoplastic elastomer to obtain a mixture; and (iii) mixing together the obtained mixture and the polyphenylene ether-modified butadiene prepolymer, a resin varnish, a prepreg, and a metal-clad laminate provided using the same.

  本发明提供了一种生产热固性树脂清漆的工艺，用该清漆可生产出印刷电路板，其中的印刷电路板在高频段具有优异的介电性能，可显著降低传输损耗，吸湿后具有优异的耐热性和优异的热膨胀性能，并满足金属箔的剥离强度。 一种含有热固性树脂组合物的热固性树脂清漆的生产工艺，该热固性树脂组合物含有未固化的半 IPN 复合材料、无机填料和饱和热塑性弹性体，其中该工艺包括以下步骤：(i) 在(A)聚苯醚存在下，初步反应(B)丁二烯聚合物，该聚合物在其分子中含有 40% 或更多的 1，2-丁二烯单元，其侧链中含有 1，2-乙烯基，且未进行化学改性，以及(C)交联剂，以获得聚苯醚改性的丁二烯预聚物，该预聚物是一种未固化的半 IPN 复合材料；(ii) 将(D)无机填料和(E)饱和热塑性弹性体混合在一起，得到一种混合物；以及 (iii) 将得到的混合物和聚苯醚改性丁二烯预聚物、树脂清漆、预浸料以及使用该混合物提供的金属包覆层压板混合在一起。
• Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same
  申请人：Hitachi Chemical Co., Ltd.

  公开号：EP2407503A1

  公开（公告）日：2012-01-18

  Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition comprising a polyphenylene ether-modified butadiene prepolymer comprising a polyphenylene ether (A) and a butadiene polymer (B'), characterized in that the component (A) has a number average molecular weight in the range of 7000 to 30000; the component (B') comprises 40% or more of a unit derived from a 1,2-butadiene unit having a 1,2-vinyl group in a side chain; the component (B') is not a modified polybutadiene in which the 1,2-vinyl group in the side chain, or one or both of the terminals in the molecule of the component (B') is/are chemically modified by converting into epoxy, glycol, phenol, maleic acid, (meth)acryl, or urethane; and the component (B') has a cross-linked structure; and a resin varnish, a prepreg and a metal clad laminated board using the same.

  本发明提供了一种可用于生产印刷电路板的热固性树脂组合物，该组合物在高频段具有良好的介电性能，从而可显著降低传输损耗，在吸湿后具有优异的耐热性和热膨胀性能，并可满足树脂组合物与金属箔之间的剥离强度。 本发明涉及一种热固性树脂组合物，该组合物包含一种聚苯醚改性丁二烯预聚物，该预聚物由聚苯醚（A）和丁二烯聚合物（B'）组成，其特征在于：组分（A）的平均分子量在 7000 至 30000 之间；组分（B'）包含 40% 或更多的由 1，2-丁二烯单元衍生而来的单元，该单元的侧链中含有 1，2-乙烯基；组分（B'）不是改性聚丁二烯，其中侧链中的 1,2-乙烯基或组分（B'）分子中的一个或两个末端通过转化为环氧、乙二醇、苯酚、马来酸、（甲基）丙烯酸或聚氨酯而被化学改性；以及组分（B'）具有交联结构。
• Thermosetting resin composition of semi-ipn composite, and varnish, prepreg and metal clad laminated board using the same
  申请人：Hitachi Chemical Co., Ltd.

  公开号：EP2546287A1

  公开（公告）日：2013-01-16

  Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition comprising a polyphenylene ether-modified butadiene prepolymer comprising a polyphenylene ether (A) and a butadiene polymer (B'), characterized in that the component (A) has a number average molecular weight in the range of 7000 to 30000; the component (B') comprises 40% or more of a unit derived from a 1,2-butadiene unit having a 1,2-vinyl group in a side chain; the component (B') is not a modified polybutadiene in which the 1,2-vinyl group in the side chain, or one or both of the terminals in the molecule of the component (B') is/are chemically modified by converting into epoxy, glycol, phenol, maleic acid, (meth)acryl, or urethane; and the component (B') has a cross-linked structure; and a resin varnish, a prepreg and a metal clad laminated board using the same.

  本发明提供了一种可用于生产印刷电路板的热固性树脂组合物，该组合物在高频段具有良好的介电性能，从而可显著降低传输损耗，在吸湿后具有优异的耐热性和热膨胀性能，并可满足树脂组合物与金属箔之间的剥离强度。 本发明涉及一种热固性树脂组合物，该组合物包含一种聚苯醚改性丁二烯预聚物，该预聚物由聚苯醚（A）和丁二烯聚合物（B'）组成，其特征在于：组分（A）的平均分子量在 7000 至 30000 之间；组分（B'）包含 40% 或更多的由 1，2-丁二烯单元衍生而来的单元，该单元的侧链中含有 1，2-乙烯基；组分（B'）不是改性聚丁二烯，其中侧链中的 1,2-乙烯基或组分（B'）分子中的一个或两个末端通过转化为环氧、乙二醇、苯酚、马来酸、（甲基）丙烯酸或聚氨酯而被化学改性；以及组分（B'）具有交联结构。