1,1-二苯基双胍 | 221326-24-5

• 分子结构分类: 有机化合物 - 有机氮化合物
• 中文名称: 1,1-二苯基双胍
• 英文名称: 1,1-diphenyl-biguanide
• 英文别名: 1,1-Diphenyl-biguanid；ω.ω-Diphenyl-biguanid；N.N-Diphenyl-N'-guanyl-guanidin；β-Diphenylbiguanid；2-Carbamimidoyl-1,1-diphenylguanidine
• CAS: 221326-24-5
• 化学式: C₁₄H₁₅N₅
• 分子量: 253.307
• InChiKey: YCSQZLPVAFDPDM-UHFFFAOYSA-N

物化性质

• 沸点：
  380.7±25.0 °C(Predicted)
• 密度：
  1.22±0.1 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  1.8
• 重原子数：
  19
• 可旋转键数：
  4
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  91.5
• 氢给体数：
  3
• 氢受体数：
  1

反应信息

• 作为反应物：
  描述：

  1,1-二苯基双胍 、 alkaline earth salt of/the/ methylsulfuric acid 生成 二苯胺
  参考文献：
  名称：

  Emich, Monatshefte fur Chemie, 1891, vol. 12, p. 20

  摘要：

  DOI：
• 作为产物：
  描述：

  二苯胺盐酸盐 、 二聚氰胺 在 乙醇 作用下， 生成 1,1-二苯基双胍
  参考文献：
  名称：

  Emich, Monatshefte fur Chemie, 1891, vol. 12, p. 20

  摘要：

  DOI：

文献信息

• PREPREG AND CARBON FIBER-REINFORCED COMPOSITE MATERIAL
  申请人：TORAY INDUSTRIES, INC.

  公开号：US20150210813A1

  公开（公告）日：2015-07-30

  A prepreg includes; sizing agent-coated carbon fibers coated with a sizing agent; and a thermosetting resin composition impregnated into the sizing agent-coated carbon fibers. The sizing agent includes an aliphatic epoxy compound (A) and an aromatic compound (B) at least containing an aromatic epoxy compound (B1). The thermosetting resin composition includes a thermosetting resin (D) and a latent hardener (E), and optionally includes an additive (F) other than the thermosetting resin (D) and the latent hardener (E). The (a)/(b) ratio is within a predetermined range where (a) is the height of a component at a binding energy assigned to CHx, C—C, and C═C and (b) is the height of a component at a binding energy assigned to C—O in a C 1s core spectrum of the surfaces of the sizing agent-coated carbon fibers analyzed by X-ray photoelectron spectroscopy.

  预浸料包括：涂有分散剂的碳纤维，涂有分散剂；以及浸渍在涂有分散剂的碳纤维中的热固性树脂组合物。分散剂包括脂肪族环氧化合物（A）和至少含有芳香族环氧化合物（B1）的芳香族化合物（B）。热固性树脂组合物包括热固性树脂（D）和潜在硬化剂（E），并且可选地包括除热固性树脂（D）和潜在硬化剂（E）以外的添加剂（F）。在由X射线光电子能谱分析的涂有分散剂的碳纤维表面的C1s光谱中，（a）是分配给CHx，C-C和C═C的结合能的组分高度，（b）是分配给C-O的结合能的组分高度，（a）/（b）比值在预定范围内。
• PREPREG AND CARBON FIBER REINFORCED COMPOSITE MATERIAL
  申请人：TORAY INDUSTRIES, INC.

  公开号：US20150252184A1

  公开（公告）日：2015-09-10

  To provide a prepreg and a carbon fiber reinforced composite material that are excellent in adhesion between a matrix resin and carbon fibers and long-term storage stability and also excellent in microcrack resistance due to the increased toughness. The present invention provides a prepreg that includes; agent-coated carbon fibers coated with a sizing agent; and a thermosetting resin composition impregnated into the sizing agent-coated carbon fibers. The sizing agent includes an aliphatic epoxy compound (A) and an aromatic epoxy compound (B1). The sizing agent-coated carbon fibers are in a shape of woven fabric or braid. The thermosetting resin composition includes a thermosetting resin (D), a thermoplastic resin (F), and a latent hardener (G). The sizing agent-coated carbon fibers have an (a)/(b) ratio in a certain range where (a) is the height of a component at a binding energy assigned to CHx, C—C, and C═C and (b) is the height of a component at a binding energy assigned to C—O in a C 1s core spectrum of the surfaces of the sizing agent-coated carbon fibers analyzed by X-ray photoelectron spectroscopy.

  提供一种预浸料和碳纤维增强复合材料，其在基体树脂和碳纤维之间具有优异的附着性和长期储存稳定性，并且由于增加韧性而具有优异的微裂纹抗性。本发明提供一种预浸料，其包括：涂有分散剂的碳纤维；以及浸渍在涂有分散剂的碳纤维中的热固性树脂组合物。分散剂包括脂肪族环氧化合物（A）和芳香族环氧化合物（B1）。涂有分散剂的碳纤维呈编织物或编织带状。热固性树脂组合物包括热固性树脂（D）、热塑性树脂（F）和潜在硬化剂（G）。涂有分散剂的碳纤维在X射线光电子能谱分析的表面C1s谱中，具有（a）在分配给CHx、C—C和C═C的结合能处的组分高度和（b）在分配给C—O的结合能处的组分高度之间的（a）/（b）比率在一定范围内。
• COPPER ALLOY COMPOSITION
  申请人：Asahi Kasei Kogyo Kabushiki Kaisha

  公开号：EP0470262A1

  公开（公告）日：1992-02-12

  A copper alloy composition comprising 100 parts by weight of a powdery copper alloy of the general formula Agxuy (wherein 0.001 ≦ x ≦ 0.999, 0.001 ≦ y ≦ 0.999 and x + y = 1), 5 to 200 parts by weight of an organic binder, and 0.01 to 100 parts by weight of an additive which serves to remove copper oxides; and a paste for screen printing, an electromagnetic wave shield, a conductive adhesive, a paste for electrodes, and a paste for through holes each prepared from the composition.

  一种铜合金组合物，包括按重量计 100 份通式为 Agxuy 的粉状铜合金（其中 0.001 ≦ x ≦ 0.999，0.001 ≦ y ≦ 0.999 和 x + y = 1）、按重量计 5 至 200 份有机粘合剂和按重量计 0.01 至 100 份（按重量计）用于去除铜氧化物的添加剂；以及由该组合物制备的丝网印刷浆料、电磁波屏蔽、导电粘合剂、电极浆料和通孔浆料。
• Prepreg for laminate and process for producing printed wiring-board using the same
  申请人：Ajinomoto Co., Ltd.

  公开号：EP0844272A2

  公开（公告）日：1998-05-27

  A prepreg for a laminate has good heat resistance, electrical insulation properties and adhesion strength of a conductor layer, and may be used to manufacture a printed wiring-board having high density and which likewise has good heat resistance and electrical insulation properties. The prepreg is suitable for use with the conventional production equipment and methods of laminate-pressing. The prepreg is characterized in that a paper-like or fabric-like substrate is dipped in an epoxy resin composition capable of forming a roughened surface through roughening treatment. A laminate may be obtained by using the prepreg and a printed wiring-board obtained by using the laminate. A process for producing the wiring board comprises (1) a step of forming a roughened surface by subjecting the surface of the laminate to the roughening treatment, and (2) a step of forming a conductor layer on the roughened surface of the laminate. A multi-layer printed wiring-board may be produced using a process which comprises (1) a step of laminating the prepreg with an inner layer material such that the prepreg is disposed on the surface, and pressing them to form a laminate, (2) a step of subjecting the surface of the laminate to the roughening treatment to form a roughened surface, and (3) a step of forming a conductor layer on the roughened surface of the laminate.

  一种用于层压板的预浸料具有良好的耐热性、电绝缘性能和导体层的附着强度，可用于制造具有高密度的印刷线路板，该线路板同样具有良好的耐热性和电绝缘性能。这种预浸料适用于传统的层压生产设备和方法。 预浸料的特点是将纸质或织物状基材浸入环氧树脂组合物中，通过粗化处理形成粗化表面。 使用预浸料可获得层压板，使用层压板可获得印刷线路板。生产布线板的工艺包括：(1) 通过对层压板表面进行粗化处理形成粗化表面的步骤；(2) 在层压板粗化表面上形成导体层的步骤。多层印刷线路板的生产工艺包括：(1)将预浸料与内层材料层压，使预浸料位于表面上，然后压制形成层压板；(2)将层压板的表面进行粗化处理，形成粗化表面；(3)在层压板的粗化表面上形成导体层。
• EPOXY RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL
  申请人：TORAY INDUSTRIES, INC.

  公开号：EP2036950A1

  公开（公告）日：2009-03-18

  The present invention relates to an epoxy resin composition comprising the following [A], [A'], [B], and [C]: [A] a bisphenol-type epoxy resin having a glass transition temperature or melting point of 50°C or higher; [A'] an epoxy resin which is in a liquid state at 25°C; [B] an epoxy resin curing agent; and [C] at least one block copolymer selected from the group consisting of S-B-M, B-M, and M-B-M, wherein the blocks are linked to each other by a covalent bond or by an intermediate molecule bound to one of the blocks via one covalent bond formation and to the other block via another covalent bond formation; the block M is a methyl methacrylate homopolymer or a copolymer comprising at least 50% by weight of methyl methacrylate; the block B is incompatible with the block M and has a glass transition temperature of 20°C or lower; and the block S is incompatible with the blocks B and M and has a glass transition temperature higher than that of the block B, a prepreg obtained by impregnating a fiber base with the epoxy resin composition, and a fiber-reinforced composite material obtained by curing the prepreg.

  本发明涉及一种环氧树脂组合物，该组合物由以下[A]、[A']、[B]和[C]组成：[A]玻璃化温度或熔点为 50℃或更高的双酚型环氧树脂；[A']在 25℃时呈液态的环氧树脂；[B]环氧树脂固化剂；和[C]至少一种嵌段共聚物，选自 S-B-M、B-M 和 M-B-M，其中嵌段通过共价键相互连接，或通过一种共价键形成的中间分子与其中一个嵌段结合，并通过另一种共价键形成的中间分子与另一个嵌段结合；嵌段 M 是甲基丙烯酸甲酯均聚物或共聚物，其中甲基丙烯酸甲酯的重量比至少为 50%；嵌段 B 与嵌段 M 不相容，其玻璃化转变温度为 20°C 或更低；嵌段 S 与嵌段 B 和嵌段 M 不相容，其玻璃化转变温度高于嵌段 B、通过用环氧树脂组合物浸渍纤维基获得的预浸料，以及通过固化预浸料获得的纤维增强复合材料。