1,10-双(马来酰亚胺)癸烷 | 39763-02-5

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吡咯烷类
• 中文名称: 1,10-双(马来酰亚胺)癸烷
• 英文名称: N,N'-Decamethylendimaleinimid
• 英文别名: 1,10-Bis-maleinimido-decan；1-[10-(2,5-Dioxopyrrol-1-yl)decyl]pyrrole-2,5-dione
• CAS: 39763-02-5
• 化学式: C₁₈H₂₄N₂O₄
• 分子量: 332.4
• InChiKey: VBRQKZUHWJXGLS-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.3
• 重原子数：
  24
• 可旋转键数：
  11
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.56
• 拓扑面积：
  74.8
• 氢给体数：
  0
• 氢受体数：
  4

反应信息

• 作为产物：
  描述：

  2,2'-(decane-1,10-diyl)bis(3a,4,7,7a-tetrahydro-1H-4,7-epoxyisoindole-1,3(2H)-dione) 以 1,1,2,2-四氯乙烷 为溶剂， 反应 12.0h， 以95%的产率得到1,10-双(马来酰亚胺)癸烷
  参考文献：
  名称：

  An efficient reverse Diels–Alder approach for the synthesis of N-alkyl bismaleimides

  摘要：

  Bismaleimides are useful precursors for Diels-Alder reactions, Michael additions, and thiol-maleimide based conjugation for the synthesis of materials and polymers. Use of bismaleimide cross linkers for generating polymers, bioconjugate molecules, and useful imaging molecules is an active area of research. An efficient and practical synthetic protocol for N-alkyl bis-maleimide cross linkers starting from furan protected maleimide employing a reverse Diels-Alder reaction is reported. (C) 2013 Elsevier Ltd. All rights reserved.

  DOI：

  10.1016/j.tetlet.2013.07.002

文献信息

• A new class of bradykinin antagonists: synthesis and in vitro activity of bissuccinimidoalkane peptide dimers
  作者：John C. Cheronis、Eric T. Whalley、Khe T. Nguyen、Shad R. Eubanks、Lisa G. Allen、Matthew J. Duggan、Sharon D. Loy、Kathryn A. Bonham、James K. Blodgett

  DOI：10.1021/jm00087a010

  日期：1992.5

  potency. Rank order of antagonist potency as a function of dimerization position is as follows: rat uterus, 6 greater than 5 greater than 0 greater than 2 greater than 1 greater than 3 much greater than 4, 7, 8, 9; guinea pig ileum, 6 greater than 5 greater than 3 greater than 2 greater than 1 greater than 0 much greater than 4, 7, 8, 9. Evaluation of the linker length as represented by the number of methylene

  对缓激肽（BK）拮抗剂D-Arg0-Arg1-Pro2-Hyp3-Gly4-Phe5-Ser6-D-Phe 7-Leu8-Arg9的二聚化进行了系统研究。该研究的第一部分涉及化合物，其中通过用半胱氨酸顺序替换每个氨基酸并与双马来酰亚胺基己烷交联来进行二聚化。这项研究的第二部分利用了一系列的双琥珀酰亚胺基烷烃二聚体，其中中间的亚甲基链系统地从n = 2变为n = 12，而二聚化的点在位置6保持不变。在两种不同的分离组织制剂中，BK诱导的平滑肌收缩：豚鼠回肠（GPI）和大鼠子宫（RU）。几种二聚体BK拮抗剂表现出卓越的活性和长效作用。另外，在4、7、8或9位的二聚化产生具有显着降低的效力的二聚体类似物。拮抗剂效价作为二聚化位置的函数的等级次序如下：大鼠子宫，大于6的6大于5，大于2的大于2，大于1的大于3，大于3的大于4、7、8、9；豚鼠回肠，大于6大于5大于3大于2大于1大于0大于4、7、8
• COMPOSITION FOR FORMING OPTICAL COMPONENT, OPTICAL COMPONENT, COMPOUND, AND RESIN
  申请人：Mitsubishi Gas Chemical Company, Inc.

  公开号：US20210309595A1

  公开（公告）日：2021-10-07

  Provided is a composition containing a polyphenol compound (B) and a solvent, in which the polyphenol compound (B) is at least one selected from a compound represented by the following formula (1) and a resin having a structure represented by the following formula (2): wherein R Y , R T , X, m, N, r, and L are as described in the description.

  提供的是含有多酚化合物(B)和溶剂的组合物，其中多酚化合物(B)至少选自以下式子(1)所表示的化合物和以下式子(2)所表示的具有结构的树脂之一：其中RY、RT、X、m、N、r和L如说明书中所述。
• An adhesive system for bonding uncured rubber to cured polyurethane
  申请人：BRIDGESTONE/FIRESTONE, INC.

  公开号：EP0358084A2

  公开（公告）日：1990-03-14

  A thermosetting adhesive comprising a bis­maleimide compound and an isocyanate-terminated rubber polymer adapted to coreact upon heating is applied to substrate surfaces of a cured polyurethane and an uncured rubber compound. Upon heating, the adhesive crosslinks and the uncured rubber compound is preferably cured simultaneously. The adhesive is particularly useful in the fabrication of compositions by the bonding of cured polyurethane to an uncured rubber compound which becomes cured during the bonding process, such as in the con­struction of tires containing cured polyurethane rein­forcements within uncured rubber carcasses, the retread­ing of tires containing polyurethane repairs, etc.

  将一种由双马来酰亚胺化合物和异氰酸酯封端橡胶聚合物组成的热固性粘合剂涂抹在已固化聚氨酯和未固化橡胶复合物的基材表面，使其在加热时发生芯层反应。加热时，粘合剂交联，未固化的橡胶复合物最好同时固化。这种粘合剂特别适用于通过将固化聚氨酯粘合到未固化橡胶复合物（在粘合过程中变得固化）来制造组合物，例如在未固化橡胶胎体中含有固化聚氨酯补强材料的轮胎制造、含有聚氨酯修补材料的轮胎翻新等。
• ELECTRICALLY CONDUCTIVE ADHESIVE FILM, AND DICING/DIE-BONDING FILM USING SAME
  申请人：Furukawa Electric Co., Ltd.

  公开号：EP3415576A1

  公开（公告）日：2018-12-19

  There is provided an electrically conductive adhesive film which can be suitably used as an electrically conductive bonding material for bonding a semiconductor chip (particularly a power device) onto an element-supporting part of a lead frame or onto a circuit electrode part of an insulating substrate, for example, and which is capable of forming, between the semiconductor chip and the element-supporting part of a lead frame or the circuit electrode part of an insulating substrate, a bonding layer that has particularly excellent electrical conductivity and excels both in heat resistance after bonding and sintering and in mounting reliability while being lead-free, and a dicing-die bonding film using the same. The electrically conductive adhesive film of the present invention comprises a metal particle (P) and a resin (M), the resin (M) comprises a thermosetting resin (M1), and the metal particle (P) has an average particle size (d50) of 20 µm or less and comprise 10 % by mass or more of a first metal particle (P1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.

  本发明提供了一种导电性粘接薄膜，它可适当用作导电性粘接材料，用于将半导体芯片（特别是功率器件）粘接到引线框架的元件支撑部分或绝缘基板的电路电极部分等，并能在半导体芯片和引线框架的元件支撑部分或绝缘基板的电路电极部分之间形成粘接层、在半导体芯片和引线框架的元件支撑部分或绝缘基板的电路电极部分之间，形成导电性能特别优异、在粘接和烧结后的耐热性能以及安装可靠性方面都非常出色且不含铅的粘接层，以及使用该粘接层的切割芯片粘接薄膜。 本发明的导电性粘合膜包括金属颗粒（P）和树脂（M），树脂（M）包括热固性树脂（M1），金属颗粒（P）的平均粒径（d50）为 20 µm 或更小，并且包含 10% 或更多的第一金属颗粒（P1）（按质量计），第一金属颗粒（P1）在原生颗粒状态下的投影图中的分形尺寸为 1.1 或更大。
• OPTICAL COMPONENT-FORMING COMPOSITION, OPTICAL COMPONENT, COMPOUND, AND RESIN
  申请人：MITSUBISHI GAS CHEMICAL COMPANY, INC.

  公开号：EP3831882A1

  公开（公告）日：2021-06-09

  Provided is a composition containing a polyphenol compound (B) and a solvent, in which the polyphenol compound (B) is at least one selected from a compound represented by the following formula (1) and a resin having a structure represented by the following formula (2) : wherein RY, RT, X, m, N, r, and L are as described in the description.

  本发明提供了一种含有多酚化合物（B）和溶剂的组合物，其中多酚化合物（B）至少选自下式（1）表示的化合物和具有下式（2）表示的结构的树脂中的一种： 其中 RY、RT、X、m、N、r 和 L 如说明书所述。