4,4'-Bis(3,4-xylyloxy)biphenyl | 26177-80-0

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4,4'-Bis(3,4-xylyloxy)biphenyl
• 英文别名: 4,4'-Bis(3,4-dimethylphenoxy)biphenyl；4-[4-[4-(3,4-dimethylphenoxy)phenyl]phenoxy]-1,2-dimethylbenzene
• CAS: 26177-80-0
• 化学式: C₂₈H₂₆O₂
• 分子量: 394.513
• InChiKey: MXKALZPCQYXZAR-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  8.1
• 重原子数：
  30
• 可旋转键数：
  5
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.14
• 拓扑面积：
  18.5
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• HIGHLY HEAT CONDUCTIVE POLYIMIDE FILM, HIGHLY HEAT CONDUCTIVE METAL-CLAD LAMINATE AND METHOD FOR PRODUCING SAME
  申请人：NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.

  公开号：EP2325000B1

  公开（公告）日：2013-05-29
• Laminate for wiring board
  申请人：Adachi Yasuhiro

  公开号：US20080057299A1

  公开（公告）日：2008-03-06

  The present invention aims to provide a polyimide resin excellent in heat resistance, dimensional stability, and toughness as an insulating layer, and to obtain a laminate suitable for a flexible wiring board by using the polyimide resin, the laminate being excellent in resistance to rupture and flexibility even when the thickness of a polyimide resin layer is small. Provided is a laminate for a wiring board having a metal layer on at least one surface of a polyimide resin layer, in which a polyimide resin layer (A) obtained by imidating a polyimide precursor resin having a weight average molecular weight of 150,000 to 800,000 is a main polyimide resin layer, and a polyimide resin of which the main polyimide resin layer is constituted has structural units represented by the following general formulae (1) and (2) where R represents a lower alkyl group, a phenyl group, or a halogen atom, and Ar 1 represents a residue of bis(aminophenoxy)benzene or bis(aminophenoxy)naphthalene.
• RESIN PASTE FOR DIE BONDING, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
  申请人：Mori Syuichi

  公开号：US20100155969A1

  公开（公告）日：2010-06-24

  The die bonding resin paste of the invention comprises a polyurethaneimide resin represented by the following general formula (I), a thermosetting resin, a filler and a printing solvent. [wherein R1 represents a divalent organic group containing an aromatic ring or aliphatic ring, R2 represents a divalent organic group with a molecular weight of 100-10,000, R3 represents a tetravalent organic group containing 4 or more carbon atoms, and n and m each independently represent an integer of 1-100.]
• HIGHLY HEAT CONDUCTIVE POLYIMIDE FILM, HIGHLY HEAT CONDUCTIVE METAL-CLAD LAMINATE, AND METHOD FOR PRODUCING THE SAME
  申请人：Aoyagi Eijiro

  公开号：US20110165410A1

  公开（公告）日：2011-07-07

  Provided is a highly heat conductive metal-clad laminate which shows heat resistance, dimensional stability, workability, and adhesiveness and excellent thermal conductivity properties. Also provided is a highly heat conductive polyimide film. The highly heat conductive metal-clad laminate has a metal layer on one or both sides of an insulating layer which has a heat conductive filler-filled polyimide layer. The insulating layer of the highly heat conductive metal-clad laminate or the highly heat conductive polyimide film having the filler-filled polyimide layer is characterized in that the content of the heat conductive filler in the filler-filled polyimide layer is 20-80 wt %, the heat conductive filler contains a plate-like filler with an average length D L of 0.1-15 μm and a spherical filler with an average particle diameter D R of 0.05-10 μm, D L and D R satisfy the relationship D L >D R /2, no heat conductive filler of 30 μmor more is contained, and the coefficient of thermal expansion is in the range of 10-30 ppm/K.
• POLYMER SYNTHESIS AND THERMALLY REARRANGED POLYMRES AS GAS SEPARATION MEMBRANES
  申请人：Freeman Benny D.

  公开号：US20120329958A1

  公开（公告）日：2012-12-27

  The present invention includes a polymer formed by the thermal rearrangement of an ortho-functional polyimide synthesized via chemical imidization with permeation properties for gas separation membranes higher than those synthesized via thermal imidization and a method for forming that polymer having tailored transport properties and different chemical resistance. The present invention also includes a polymer formed by the thermal rearrangement of an ortho-functional polyimide in which a portion of the ortho-position functional group is lost during thermal rearrangement to yield a thermally rearranged polymer with higher permeability than would be seen without the ortho-position group. This ortho-position group can be the result of chemical imidization, or the result of a post-imidization modification reaction.