申请人:SUMITOMO BAKELITE CO., LTD.
公开号:EP1195811A1
公开(公告)日:2002-04-10
The present invention alleviates the operational problems in production of flip chips and provides a semiconductor device superior in various reliabilities. The preset invention lies in an encapsulated semiconductor device comprising:
a polybenzoxazole resin film for chip protection, obtained by coating, on a circuit-formed chip, a positive photosensitive resin composition comprising 100 parts by weight of a polyamide and 1 to 100 parts by weight of a photosensitive diazoquinone compound, and subjecting the coated composition to patterning and curing, and
(b) a bump electrode.
本发明缓解了倒装芯片生产过程中的操作问题,并提供了一种在各种可靠性方面都更胜一筹的半导体器件。本发明预设的封装半导体器件包括:
用于芯片保护的聚苯并恶唑树脂薄膜,该薄膜是通过在电路成型芯片上涂布一种正性光敏树脂组合物而获得的,该组合物由按重量计 100 份的聚酰胺和按重量计 1 至 100 份的光敏重醌化合物组成,并将涂布的组合物进行图案化和固化,和
(b) 凹凸电极。