A metal film/aromatic polyimide film laminate is composed of a composite aromatic polyimide film and a metal film, in which the composite aromatic polyimide film is composed of an aromatic polyimide substrate film having a linear expansion coefficient of 5×10
−6
to 30×10
−6
cm/cm/° C. in the temperature range of 50-200° C. (measured in machine direction), and a thin aromatic polyimide layer of polyimide prepared from a carboxylic acid component comprising a mixture of 3,3′,4,4′-biphenyltetracarboxylic dianhydride and 2,3,3′,4′-biphenyltetracarboxylic dianhydride in a molar ratio of 50:50 to 90:10 and an aromatic diamine component composed of 1,3-bis(4-aminophenoxy)benzene or a mixture of 1,3-bis(4-aminophenoxy)benzene and p-phenylenediamine and/or diaminodiphenyl ether in a molar ratio of 10/90 or more. Tg of the thin polyimide layer is 210-310° C. The metal film is fixed to the thin polyimide layer at a 90° peel resistance of 0.5 kg/cm or higher, while the thin polyimide layer is bonded to the substrate film at a 90° peel resistance higher than that between the metal film and the thin layer.
一种
金属膜/芳香族聚
酰亚胺膜层压板由复合芳香族聚
酰亚胺膜和
金属膜组成,其中复合芳香族聚
酰亚胺膜由芳香族聚
酰亚胺基膜组成,其线性膨胀系数为 5×10
-6
至 30×10
-6
厘米/厘米/摄氏度的芳香族聚
酰亚胺基材薄膜组成。(在 50-200° C 的温度范围内线性膨胀系数为 5×10 -6 至 30×10 -6 cm/cm/° C 的聚
酰亚胺基底薄膜(在机器方向上测量),以及由
羧酸组分制备的聚
酰亚胺芳香族聚
酰亚胺薄层,
羧酸组分包括 3,3′,4,4′-
联苯四
羧酸二酐和 2,3,3′,4′-
联苯四
羧酸二酐的混合物,摩尔比为 50:50至90:10,以及由1,3-双(4-
氨基苯氧基)苯或1,3-双(4-
氨基苯氧基)苯与
对苯二胺和/或二
氨基
二苯醚的混合物组成的芳香族二胺组分,摩尔比为10/90或更高。
金属膜固定在聚
酰亚胺薄层上的 90° 剥离阻力为 0.5 kg/cm 或更高,而聚
酰亚胺薄层粘合在基材薄膜上的 90° 剥离阻力高于
金属膜和薄层之间的 90° 剥离阻力。