Optically active compound and photosensitive resin composition
申请人:——
公开号:US20030211421A1
公开(公告)日:2003-11-13
A photoactive compound is used in combination with a photosensitizer, represented by the following formula (1):
A
−[(
J
)
m
−(
X-Pro
)]
n
(1)
wherein A represents a hydrophobic unit comprising at least one kind of hydrophobic groups selected from a hydrocarbon group and a heterocyclic group, J represents a connecting group, X-Pro represents a hydrophilic group protected by a protective group Pro which is removable by light exposure, m represents 0 or 1, and n represents an integer of not less than 1.
The protective group Pro may be removable by light exposure in association with the photosensitizer (especially, a photo acid generator), or may be a hydrophobic protective group. The hydrophilic group may be a hydroxyl group or a carboxyl group. The photoactive compound has high sensitivity to a light source of short wavelength beams, for resist application, therefore, the photoactive compound is advantageously used for forming a pattern with high resolution.
一种光活性化合物与光敏剂结合使用,由以下公式(1)表示:
A
−[(
J
)
m
−(
X-Pro
)]
n
(1)
其中,A代表至少包括一种从烃基和杂环基中选择的疏水基的疏水单元,J代表连接基团,X-Pro代表由光照可去除的保护基团Pro保护的亲水基团,m代表0或1,n代表不少于1的整数。
保护基团Pro可以与光敏剂(特别是光酸发生剂)一起通过光照可去除,也可以是疏水保护基团。亲水基团可以是羟基或羧基。光活性化合物对短波长光源具有很高的敏感性,用于光刻应用,因此,该光活性化合物有利于形成具有高分辨率的图案。
OPTICALLY ACTIVE COMPOUND AND PHOTOSENSITIVE RESIN COMPOSITION
申请人:Kansai Research Institute, Inc.
公开号:EP1375463A1
公开(公告)日:2004-01-02
A photoactive compound is used in combination with a photosensitizer, represented by the following formula (1):
A-[(J)m-(X-Pro)]n (1)
wherein A represents a hydrophobic unit comprising at least one kind of hydrophobic groups selected from a hydrocarbon group and a heterocyclic group, J represents a connecting group, X-Pro represents a hydrophilic group protected by a protective group Pro which is removable by light exposure, m represents 0 or 1, and n represents an integer of not less than 1.
The protective group Pro may be removable by light exposure in association with the photosensitizer (especially, a photo acid generator), or may be a hydrophobic protective group. The hydrophilic group may be a hydroxyl group or a carboxyl group. The photoactive compound has high sensitivity to a light source of short wavelength beams, for resist application, therefore, the photoactive compound is advantageously used for forming a pattern with high resolution.
光活性化合物与光敏剂结合使用,光敏剂由下式(1)表示:
A-[(J)m-(X-Pro)]n (1)
其中 A 代表疏水单元,包括至少一种选自烃基和杂环基的疏水基团;J 代表连接基团;X-Pro 代表亲水基团,该亲水基团受保护基团 Pro 的保护,该保护基团可通过光照去除;m 代表 0 或 1;n 代表不小于 1 的整数。
保护基 Pro 可以通过与光敏剂(特别是光酸发生器)一起进行光照射而去除,也可以是疏水保护基。亲水基团可以是羟基或羧基。光活性化合物对短波长光束的光源具有很高的灵敏度,因此在抗蚀剂应用中,光活性化合物可用于形成具有高分辨率的图案。
Chemoselective O-tert-butoxycarbonylation of phenols using 6,7-dimethoxyisoquinoline as a novel organocatalyst
作者:Yukako Saito、Yuichi Yoshimura、Hiroki Takahata
DOI:10.1016/j.tetlet.2010.10.114
日期:2010.12
The chemoselective O-tert-butoxycarbonylation of phenols using low levels (5-0.1 mol %) of 6,7-dimethoxyisoquinoline as a reusableorganocatalyst is described. (C) 2010 Elsevier Ltd. All rights reserved.
RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN
申请人:SUMITOMO CHEMICAL COMPANY, LIMITED
公开号:US20210311392A1
公开(公告)日:2021-10-07
Disclosed is a resist composition including a compound represented by formula (I), a resin having an acid-labile group and an acid generator, the resin having an acid-labile group including at least one selected from the group consisting of a structural unit represented by formula (a1-1) and a structural unit represented by formula (a1-2):
PHOTORESIST COMPOSITIONS, METHODS FOR FORMING PATTERN USING THE SAME, AND METHODS FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
申请人:Samsung Electronics Co., Ltd.
公开号:US20220128905A1
公开(公告)日:2022-04-28
Photoresist compositions improving the quality of a photoresist pattern, methods for forming a pattern using the same, and methods for fabricating a semiconductor device using the same are provided. The photoresist composition includes a photosensitive resin, a photoacid generator, a photoacid-labile additive comprising a structure of Formula 1-1, and optionally a solvent:
Ar
2
—Y-PG
2
[Formula 1-1]
wherein Ar
1
is a substituted or unsubstituted aromatic ring, Y is an ester group, an oxycarbonyl group, an acetal group, an amide group, or a thioester group, and PG
2
is a substituted or unsubstituted secondary alkyl group, a substituted or unsubstituted tertiary alkyl group, a substituted or unsubstituted alkoxyalkyl group, a substituted or unsubstituted alkoxy group, or a substituted or unsubstituted alkyloxycarbonyl group.