氨苯砜醚二聚体杂质 | 54616-64-7

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 中文名称: 氨苯砜醚二聚体杂质
• 英文名称: 4,4'-Oxybis[p-(phenylsulfonylaniline)]
• 英文别名: 4-[4-[4-(4-aminophenyl)sulfonylphenoxy]phenyl]sulfonylaniline
• CAS: 54616-64-7
• 化学式: C₂₄H₂₀N₂O₅S₂
• 分子量: 480.6
• InChiKey: CAIMXHCQEIPTCR-UHFFFAOYSA-N

物化性质

• 沸点：
  741.8±60.0 °C(Predicted)
• 密度：
  1.408±0.06 g/cm3(Predicted)
• 溶解度：
  DMSO（少量）、甲醇（少量）

计算性质

• 辛醇/水分配系数(LogP)：
  3
• 重原子数：
  33
• 可旋转键数：
  6
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  146
• 氢给体数：
  2
• 氢受体数：
  7

文献信息

• Aromatic polythioetheramides and process for their production
  申请人：MITSUBISHI PETROCHEMICAL CO., LTD.

  公开号：EP0162606A1

  公开（公告）日：1985-11-27

  Aromatic polythioetheramides have repeating units represented by one or both of the following formulae and wherein X is C1-C10 divalent hydrocarbon, -0-, -S-, - SO-, - SO2- or -CO-; a is 0 or 1; Y is C,-C20 alkyl, C3-C20 cycloalkyl, C6-C20 aralkyl, C6-C20 aryl, halogen or nitro; b, c, e and f, 0 to 4; d, 0-20 and Ar is a C6-C30 aromatic ring. Repeating units derived from C6-C30 aromatic diamines may replace up to 50 mol% of the above thioetheramide units, and from 51 to 99 mol% when Ar is isophthalyl or terephthalyl. The polymers have excellent moldability, flame retardance, heat resistance and chemical resistance, and are suitable for use as engineering plastics.

  芳香族聚硫醚酰胺的重复单元由以下一个或两个式子表示 和 其中 X 为 C1-C10 二价烃、-0-、-S-、-SO-、-SO2- 或-CO-；a 为 0 或 1；Y 为 C,-C20烷基、C3-C20 环烷基、C6-C20 芳基、C6-C20 芳基、卤素或硝基；b、c、e 和 f 为 0 至 4；d 为 0 至 20；Ar 为 C6-C30 芳环。 由 C6-C30 芳族二胺衍生的重复单元可取代高达 50 摩尔%的上述硫醚酰胺单元，当 Ar 为间苯二甲酸酯或对苯二甲酸酯时，可取代 51 至 99 摩尔%的上述硫醚酰胺单元。这些聚合物具有优异的成型性、阻燃性、耐热性和耐化学性，适合用作工程塑料。
• FLEXIBLE LAMINATE FOR PRINTED CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION
  申请人：MITSUI TOATSU CHEMICALS, Inc.

  公开号：EP0243507A1

  公开（公告）日：1987-11-04

  A polyimide film obtained by using as starting materials a symmetric aromatic m-substituted primary diamine and a symmetric aromatic P-substituted primary diamine in a given proportion. This film has excellent heat resistance, electric properties, and flexibility. In providing this film on a substrate, a precursor of the polyimide, i.e. a polyamic acid, is applied to the substrate without using any adhesives, and a reaction is allowed to proceed to form a polyimide to thereby provide the polyimide film on the substrate with good adhesiveness. The resulting flexible printed circuit board has the above-described excellent properties.

  一种聚酰亚胺薄膜，以一定比例的对称芳香族间取代伯二胺和对称芳香族间取代伯二胺为起始原料，这种薄膜具有优异的耐热性、电性能和柔韧性。 在基板上提供这种薄膜时，不使用任何粘合剂，将聚酰亚胺的前体（即聚酰胺酸）涂在基板上，然后进行反应形成聚酰亚胺，从而在基板上提供具有良好粘合性的聚酰亚胺薄膜。 所得到的柔性印刷电路板具有上述优异性能。
• Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides
  申请人：HITACHI CHEMICAL CO., LTD.

  公开号：EP0553612A2

  公开（公告）日：1993-08-04

  A polyimide comprises structural units represented by the following formula: wherein Ar is a group consisting of 10-90 mole % of a first specific structural sub-unit and 90-10 mole % of a second particular structural sub-unit. A process for the production of the polyimide and a thermosetting resin composition comprising the polyimide and a particular polymaleimide are also disclosed.

  聚酰亚胺包括下式所代表的结构单元： 其中 Ar 是由 10-90 摩尔%的第一种特定结构亚单元和 90-10 摩尔%的第二种特定结构亚单元组成的组。本发明还公开了聚酰亚胺的生产工艺以及包含聚酰亚胺和特定聚马来酰亚胺的热固性树脂组合物。
• POLYIMIDE-BASED LIQUID AND POLYIMIDE-BASED FILM PRODUCED USING SAME
  申请人：LG Chem, Ltd.

  公开号：EP3150655A1

  公开（公告）日：2017-04-05

  The present invention relates to a polyimide-based solution that can be used to produce an isotropic transparent polyimide-based film with high heat resistance and excellent mechanical properties as well as high transmittance. A coating of the polyimide-based solution on a substrate has a haze of 1% or less after storage at a temperature of 30 °C and a humidity of 70% for 30 minutes.

  本发明涉及一种聚酰亚胺基溶液，可用于生产具有高耐热性、优异机械性能和高透光率的各向同性透明聚酰亚胺基薄膜。在温度为 30 °C、湿度为 70% 的条件下存放 30 分钟后，基底上的聚酰亚胺基溶液涂层的雾度不超过 1%。
• COMPOSITION FOR POLYIMIDE FILM FOR FLEXIBLE SUBSTRATE OF OPTOELECTRONIC DEVICE
  申请人：LG Chem, Ltd.

  公开号：EP3266808A1

  公开（公告）日：2018-01-10

  Disclosed is a polyimide precursor composition for the production of a flexible board of a photoelectronic device. The polyimide precursor composition includes a polyimide precursor derived from a diamine or acid dianhydride including a structure of Formula 1: wherein R1 to R8, m1, m2, and m3 are as defined in the specification. Also disclosed is a polyimide film produced from the polyimide precursor composition. The polyimide film is obtained by applying the precursor composition to a substrate and curing the composition. The polyimide film has high transparency and good heat resistance. In addition, the polyimide film exhibits good dimensional stability because the substrate does not undergo an increase in stress even during high-temperature heat treatment.

  本发明公开了一种用于生产光电子器件柔性电路板的聚酰亚胺前体组合物。该聚酰亚胺前体组合物包括一种聚酰亚胺前体，由包括式 1 结构的二胺或酸二酐衍生而来： 其中 R1 至 R8、m1、m2 和 m3 如说明书中所定义。还公开了一种由聚酰亚胺前体组合物制成的聚酰亚胺薄膜。该聚酰亚胺薄膜是通过将前体组合物涂在基底上并固化组合物而得到的。聚酰亚胺薄膜具有高透明度和良好的耐热性。此外，聚酰亚胺薄膜还具有良好的尺寸稳定性，因为即使在高温热处理期间，基底也不会出现应力增加的情况。