The semiaromatic polyamide of the invention comprises 40 to 90 % by mol of (A) recurring units derived from terephthalic acid and an aliphatic diamine of 4 to 12 carbon atoms, 0 to 50 % by mol of (B) recurring units derived from isophthalic acid and an aliphatic diamine of 4 to 12 carbon atoms, 0 to 60 % by mol of (C) recurring units derived from an aliphatic dicarboxylic acid of 4 to 18 carbon atoms and an aliphatic diamine of 4 to 12 carbon atoms and 0 to 50 % by mol of (D) recurring units derived from a lactam or an aminocarboxylic acid of 6 to 20 carbon atoms, and has a content of boiling water-soluble components (MO components) of not more than 0.25 % by weight. The semiaromatic polyamide has a low content of the MO components, so that mold contamination hardly brought about in the molding process, and also molded articles of good heat resistance can be produced.
本发明的半芳香族聚酰胺包括 40%至 90%(以摩尔计)的(A)循环单元,这些循环单元来自
对苯二甲酸和 4 至 12 个碳原子的脂肪族二胺;0%至 50%(以摩尔计)的(B)循环单元,这些循环单元来自
间苯二甲酸和 4 至 12 个碳原子的脂肪族二胺、(C)由 4 至 18 个碳原子的脂肪族二
羧酸和 4 至 12 个碳原子的脂肪族二胺衍生的递归单元的含量为 0 至 60 %(摩尔),(D)由 6 至 20 个碳原子的内酰胺或
氨基甲酸酯衍生的递归单元的含量为 0 至 50 %(摩尔),且沸腾
水溶性成分(MO 成分)的含量不超过 0.25 %(重量百分比)。半芳香族聚酰胺的 MO 成分含量低,因此在成型过程中几乎不会造成模具污染,还能生产出耐热性良好的成型制品。