1-Dodecylpyridin-1-ium;nitrate

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吡啶及其衍生物
• 英文名称: 1-Dodecylpyridin-1-ium;nitrate
• 化学式: C17H30N2O3
• 分子量: 310.4
• InChiKey: WBKNFDMZMFHLES-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4.66
• 重原子数：
  22
• 可旋转键数：
  11
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.71
• 拓扑面积：
  66.8
• 氢给体数：
  0
• 氢受体数：
  3

文献信息

• POLISHING LIQUID
  申请人：KAMIMURA Tetsuya

  公开号：US20080203354A1

  公开（公告）日：2008-08-28

  The invention provides a polishing liquid for polishing a barrier layer of a semiconductor integrated circuit, the polishing liquid comprising: a diquaternary ammonium cation; a corrosion inhibiting agent; and a colloidal silica, wherein the pH of the polishing liquid is in the range of 2.5 to 5.0. According to the invention, a polishing liquid capable of achieving a superior barrier layer polishing rate, as well as suppressing the occurrence of scratching due to the agglomeration of solid abrasive grains can be provided.
• Polishing liquid and polishing method
  申请人：Saie Toshiyuki

  公开号：US20090215270A1

  公开（公告）日：2009-08-27

  A polishing liquid is provided which has good storage stability and is capable of inhibiting generation of scratching caused by aggregation of solid abrasive grains or the like during use. A polishing method using the polishing liquid is also provided. The polishing liquid includes: (a) an aqueous solution A including colloidal silica particles in an amount of from 5 mass % to 40 mass % with respect to the total mass of the aqueous solution A, and having a pH of from 1 to 7; and (b) an aqueous solution B including a quaternary ammonium cation, wherein the aqueous solution A and the aqueous solution B are separately prepared and mixed to provide the polishing liquid immediately before used in polishing.
• US8404146B2
  申请人：——

  公开号：US8404146B2

  公开（公告）日：2013-03-26
• US8715524B2
  申请人：——

  公开号：US8715524B2

  公开（公告）日：2014-05-06