N-{[(4,5-dimethoxy-2-nitrobenzyl)oxy]carbonyl} 2,6-dimethylpiperidine | 163518-07-8

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: N-{[(4,5-dimethoxy-2-nitrobenzyl)oxy]carbonyl} 2,6-dimethylpiperidine
• 英文别名: 1-Piperidinecarboxylic acid, 2,6-dimethyl-, (4,5-dimethoxy-2-nitrophenyl)methyl ester；(4,5-dimethoxy-2-nitrophenyl)methyl 2,6-dimethylpiperidine-1-carboxylate
• CAS: 163518-07-8
• 化学式: C₁₇H₂₄N₂O₆
• 分子量: 352.387
• InChiKey: GXPGUGRGRLIUPX-UHFFFAOYSA-N

物化性质

• 熔点：
  139.2 °C(Solv: cyclohexane (110-82-7); hexane (110-54-3))
• 沸点：
  486.7±45.0 °C(Predicted)
• 密度：
  1.191±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  3.1
• 重原子数：
  25
• 可旋转键数：
  5
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.59
• 拓扑面积：
  93.8
• 氢给体数：
  0
• 氢受体数：
  6

反应信息

• 作为反应物：
  描述：

  N-{[(4,5-dimethoxy-2-nitrobenzyl)oxy]carbonyl} 2,6-dimethylpiperidine 在 semialicyclic poly(amic acid) 作用下， 生成 2,6-二甲基哌啶
  参考文献：
  名称：

  基于半脂环族聚酰胺酸和光碱产生剂的低CTE光敏聚酰亚胺

  摘要：

  一种基于半脂环族聚（酰胺酸）（PAA），聚（反式-1,4-环己二甲苯二苯酰胺酸）和{[（（4,5--二甲氧基-2-硝基苄基）氧基]的负型光敏聚酰亚胺（PSPI）羰基} 2,6-二甲基哌啶（DNCDP）作为光碱产生剂已被开发为下一代缓冲涂层材料。在乙酸存在下，由3,3'，4,4'-联苯四甲酸二酐和反式-1,4-环己基二胺合成半脂环族PAA ，并将该PAA聚合溶液直接用于PSPI配方。此PSPI由PAA（80 wt％）和DNCDP（20 wt％）组成，当暴露于365 nm线时，显示出70 mJ / cm 2的高灵敏度和10.3的高对比度（i线），在190°C下烘烤5分钟，然后在25°C下用2.38 wt％的含有20 wt％异丙醇的氢氧化四甲铵水溶液显影。6-μm的线和空间图案的明显的负图像打印在膜，将其暴露于500毫焦耳/厘米2的我通过接触印刷模式-line和完全转化为聚（反式-1,4- cy

  DOI：

  10.1002/pola.23892

文献信息

• BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, AND PATTERN FORMING METHOD AND ARTICLE USING THE PHOTOSENSITIVE RESIN COMPOSITION
  申请人：Katayama Mami

  公开号：US20110086311A1

  公开（公告）日：2011-04-14

  A photosensitive resin composition which is excellent in resolution, low in cost, and usable in a wide range of structures of polymer precursors each of which is reacted into a final product by a basic substance or by heating in the presence of a basic substance. The photosensitive resin composition includes a base generator which has a specific structure and generates a base by exposure to electromagnetic radiation and heating, and a polymer precursor which is reacted into a final product by the base generator and by a basic substance or by heating in the presence of a basic substance.

  一种光敏树脂组合物，具有分辨率优良、成本低廉和可用于一系列聚合物前体结构的特点，其中每种聚合物前体都可以通过碱性物质或在碱性物质的存在下加热反应成为最终产物。该光敏树脂组合物包括一种具有特定结构并通过电磁辐射和加热产生碱性物质的基发生剂，以及一种聚合物前体，该聚合物前体通过基发生剂和碱性物质或在碱性物质的存在下加热反应成为最终产物。
• THIN FILM TRANSISTOR SUBSTRATE
  申请人：FUKUDA Shunji

  公开号：US20130126860A1

  公开（公告）日：2013-05-23

  A main object of the present invention is to provide a TFT substrate having excellent switching characteristics. The object is attained by providing a thin film transistor substrate comprising: a substrate, and a thin film transistor having an oxide semiconductor layer that is formed on the substrate and is formed from an oxide semiconductor, and a semiconductor layer-adjoining insulating layer formed to be in contact with the oxide semiconductor layer, wherein at least one semiconductor layer-adjoining insulating layer included in the thin film transistor is a photosensitive polyimide insulating layer formed by using a photosensitive polyimide resin composition.

  本发明的主要目的是提供一种具有优异开关特性的TFT基板。该目标通过提供一种薄膜晶体管基板来实现，该基板包括：基板和薄膜晶体管，所述薄膜晶体管具有在基板上形成的氧化物半导体层，该氧化物半导体层由氧化物半导体形成，并且与氧化物半导体层接触的半导体层相邻的绝缘层，其中，在薄膜晶体管中包括的至少一个半导体层相邻的绝缘层是使用光敏聚酰亚胺树脂组合物形成的光敏聚酰亚胺绝缘层来实现的。
• RESIN COMPOSITION, CURED PRODUCT AND OPTICAL PARTS
  申请人：Ueda Mitsuru

  公开号：US20080255284A1

  公开（公告）日：2008-10-16

  It is provided for a resin composition including (A) at least one polyamic acid having the structure represented by the following formula (1): wherein R 1 is independently an alkyl group having 1 to 3 carbon atoms or a cyano group; a is independently an integer of 0 to 4; R is a tetravalent organic group; n is an integer of 1 to 4; and m is an integer of 1 to 100,000, and (E) an organic solvent.
• POLYIMIDE PRECURSOR, RESIN COMPOSITION COMPRISING THE POLYIMIDE PRECURSOR, PATTERN FORMING METHOD USING THE RESIN COMPOSITION, AND ARTICLES PRODUCED BY USING THE RESIN COMPOSITION
  申请人：SAKAYORI Katsuya

  公开号：US20090263745A1

  公开（公告）日：2009-10-22

  It is a main object of the present invention to provide a polyimide precursor and a polyimide precursor resin composition, which precursor being easy to synthesize, available at low cost, excellent in storage and capable of giving polyimide that is low in impurities after imidization, irrespective of the chemical structure of the finally-obtained polyimide. It is another object of the present invention to provide a polyimide precursor having repeating units represented by the following formula (1) and a photosensitive resin composition comprising the polyimide precursor and a photoacid generator or photobase generator: In the formula (1), R 1 is a tetravalent organic group; R 2 is a divalent organic group; R 1 s may be the same or different from each other and R 2 s may be the same or different from each other in the repeating units; R 3 and R 4 respectively represent a monovalent organic group having a structure represented by the following formula (2) and may be the same or different from each other; and R 3 s and R 4 s in the repeating units may be the same or different from each other, respectively. In the formula (2), R 5 , R 6 and R 7 respectively represent a hydrogen atom, a halogen atom or a monovalent organic group; R 8 is a monovalent organic group; R 8 s in the repeating units may be the same or different from each other; 35 mole % or less of R 8 s are organic groups having a reactive group; and R 5 , R 6 , R 7 and R 8 may be bonded to each other to form a ring structure.
• HEAT-CONDUCTIVE SEALING MEMBER AND ELECTROLUMINESCENT ELEMENT
  申请人：Fukuda Shunji

  公开号：US20120181914A1

  公开（公告）日：2012-07-19

  Provided is a heat-conductive sealing member which has high moisture barrier properties, has heat dissipation properties, and is capable of encapsulating an element by a simple method. The heat-conductive sealing member has a metal base material, an insulating layer that is formed on the metal base material, has heat conductivity and contains at least polyimide, and a tacky adhesive layer that is formed on the insulating layer and has heat resistance.