2-Methylpropyl 3-(2,3,4,5,6-pentafluorophenyl)propanoate | 1226635-58-0

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2-Methylpropyl 3-(2,3,4,5,6-pentafluorophenyl)propanoate
• 英文别名: 2-methylpropyl 3-(2,3,4,5,6-pentafluorophenyl)propanoate
• CAS: 1226635-58-0
• 化学式: C₁₃H₁₃F₅O₂
• 分子量: 296.237
• InChiKey: RMHFULWVCQQGLT-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.8
• 重原子数：
  20
• 可旋转键数：
  6
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.46
• 拓扑面积：
  26.3
• 氢给体数：
  0
• 氢受体数：
  7

反应信息

• 作为产物：
  描述：

  丙烯酸异丁酯 、 五氟苯 在 [Rh(OH)(cod)]2 、 1,2-双(二苯基膦基)苯 、 水 作用下， 以 1,4-二氧六环 为溶剂， 反应 24.0h， 以91%的产率得到2-Methylpropyl 3-(2,3,4,5,6-pentafluorophenyl)propanoate
  参考文献：
  名称：

  Rh(I)-Catalyzed Olefin Hydroarylation with Electron-Deficient Perfluoroarenes

  摘要：

  Assisted by a partially aqueous media, a catalyst system of [Rh(cod)(OH)](2) and DPPBenzene ligand effectively promotes direct conjugate additions by perfluoroarenes. This formal C-H alkylation process represents a rare example of olefin hydroarylation with electron-deficient arenes. The catalyst system can be modified to selectively form the corresponding olefination products under anhydrous conditions.

  DOI：

  10.1021/ja102575d

文献信息

• Polymer of polyimide precursor, positive type photosensitive resin composition, negative type photosensitive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：US11150556B2

  公开（公告）日：2021-10-19

  This is to provide a polymer of a polyimide precursor which is soluble in an aqueous alkaline solution, and capable of using a base resin of a positive type and negative type photosensitive resin composition which is capable of forming a fine pattern and obtaining high resolution. Also provided is a positive type and negative type photosensitive resin composition using such a polymer of a polyimide precursor. Further provided are a patterning process and a method of forming a cured film using the composition. Provided is a polymer of a polyimide precursor which comprises a structural unit represented by the following general formula (1), wherein, X1, R1, Z, a repeating number “s”, Y1, Rf, a repeating number “n” and “k” represent the same meanings as mentioned in the specification.

  本发明旨在提供一种可溶于碱性水溶液的聚酰亚胺前体聚合物，该聚合物可用于正型和负型感光树脂组合物的基底树脂，可形成精细图案并获得高分辨率。此外，还提供了使用这种聚酰亚胺前体聚合物的正型和负型感光树脂组合物。此外，还提供了使用该组合物形成固化薄膜的图案化工艺和方法。 本发明提供了一种聚酰亚胺前体聚合物，该聚合物由以下通式 (1) 所代表的结构单元组成、 其中，X1、R1、Z、重复数字 "s"、Y1、Rf、重复数字 "n "和 "k "代表的含义与说明书中提到的相同。
• Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component
  申请人：International Business Machines Corporation

  公开号：US11333975B2

  公开（公告）日：2022-05-17

  Provided is a polymer that can be used as a base resin for a positive photosensitive resin composition and a negative photosensitive resin composition, wherein the positive photosensitive resin composition and the negative photosensitive resin composition are soluble in an aqueous alkaline solution, can form a fine pattern, can achieve high resolution, and have good mechanical properties even when they are cured at low temperature. Also provided are a positive photosensitive resin composition and a negative photosensitive resin composition using the polymer. The polymer is represented by general formulas (1) and/or (2): wherein T1 and T2 may be the same as, or different from, each other and represent any of —CO— and —SO2—; X1 is a tetravalent organic group; and l is 0 or 1; and X2 is a divalent organic group.

  本发明提供了一种聚合物，可用作正感光树脂组合物和负感光树脂组合物的基础树脂，其中正感光树脂组合物和负感光树脂组合物可溶于碱性水溶液，可形成精细图案，可实现高分辨率，即使在低温下固化也具有良好的机械性能。此外，还提供了使用该聚合物的正感光树脂组合物和负感光树脂组合物。该聚合物由通式（1）和/或（2）表示： 其中 T1 和 T2 可以彼此相同或不同，并代表 -CO- 和 -SO2- 中的任意一种；X1 是四价有机基团；l 是 0 或 1；X2 是二价有机基团。
• TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：US20180024434A1

  公开（公告）日：2018-01-25

  The present invention provides a tetracarboxylic acid diester compound shown by the following general formula (1), wherein X 1 represents a tetravalent organic group; and R 1 represents a group shown by the following general formula (2), Y 1  n Rf) k (2) wherein the dotted line represents a bond; Y 1 represents an organic group with a valency of k+1; Rf represents a linear, branched, or cyclic alkyl group having 1 to 20 carbon atoms or an aromatic group in which a part or all of hydrogen atoms is/are substituted with a fluorine atom(s); “k” represents 1, 2, or 3; and “n” represents 0 or 1. There can be provided a tetracarboxylic acid diester compound that can give a polyimide precursor polymer soluble in a safe organic solvent widely used as a solvent of a composition, and usable as a base resin of a negative photosensitive resin composition.
• POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD OF FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：US20200326624A1

  公开（公告）日：2020-10-15

  The present invention is a positive photosensitive resin composition comprising: (A-1) an alkali-soluble resin containing at least one or more structures selected from a polyimide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof; (A-2) a resin containing at least one or more structures selected from a polyimide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof, each of which has no alkali-soluble group and contains a heterocyclic skeleton having at least one or more nitrogen atoms at a molecular end; (B) a compound having a quinonediazide structure for serving as a photosensitizer to generate an acid by light and increase a dissolution speed to an alkaline aqueous solution; and (D) a solvent. This provides a positive photosensitive resin composition which is soluble in an alkaline aqueous solution, can form a fine pattern and can obtain high resolution, and has excellent mechanical characteristics even when cured at low temperatures.
• POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT
  申请人：International Business Machines Corporation

  公开号：US20210317268A1

  公开（公告）日：2021-10-14

  Provided is a polymer that can be used as a base resin for a positive photosensitive resin composition and a negative photosensitive resin composition, wherein the positive photosensitive resin composition and the negative photosensitive resin composition are soluble in an aqueous alkaline solution, can form a fine pattern, can achieve high resolution, and have good mechanical properties even when they are cured at low temperature. Also provided are a positive photosensitive resin composition and a negative photosensitive resin composition using the polymer. The polymer is represented by general formulas (1) and/or (2): wherein T 1 and T 2 may be the same as, or different from, each other and represent any of —CO— and —SO 2 —; X 1 is a tetravalent organic group; and l is 0 or 1; and X 2 is a divalent organic group.