申请人:SEKISUI CHEMICAL CO., LTD.
公开号:EP1698655A1
公开(公告)日:2006-09-06
It is an object of the present invention to provide a release film which is superior in the flexibility at high temperature, the conformability to circuit patterns, the heat resistance, the releasing property and the non-contaminative property, and easily discarded after use.
The present invention relates to a release film, which is used in a manufacturing process of a printed-circuit board, a flexible printed-circuit board or a multilayer printed-circuit board, having a layer comprising a resin composition comprising a resin having a polar group in a main chain as a matrix and having a halogen content of 5% by weight or less on at least one surface.
本发明的目的是提供一种离型膜,这种离型膜在高温下的柔韧性、对电路图案的适应性、耐热性、离型性和无污染性都很好,而且使用后容易丢弃。
本发明涉及一种用于印制电路板、柔性印制电路板或多层印制电路板制造工艺中的离型膜,该离型膜具有一层树脂组合物,该树脂组合物由主链中具有极性基团的树脂作为基体,至少在一个表面上的卤素含量不超过 5%(重量百分比)。