Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device
申请人:Horimoto Akihiro
公开号:US20050075474A1
公开(公告)日:2005-04-07
The present invention provides a latent catalyst for epoxy resin, comprising: a cation moiety having an activity of accelerating curing reaction of epoxy resin; and a silicate anion moiety of suppressing the curing reaction-accelerating activity. Also disclosed are an epoxy resin composition comprising the latent catalyst and a semiconductor device using the epoxy resin composition.
本发明提供了一种环氧树脂的潜在催化剂,包括:具有加速环氧树脂固化反应活性的阳离子基团;以及抑制固化反应加速活性的硅酸盐阴离子基团。此外,还公开了一种包含潜在催化剂的环氧树脂组合物和使用该环氧树脂组合物的半导体器件。