pyrogallol triacrilate | 86860-38-0

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯酚酯
• 英文名称: pyrogallol triacrilate
• 英文别名: [2,3-Di(prop-2-enoyloxy)phenyl] prop-2-enoate
• CAS: 86860-38-0
• 化学式: C₁₅H₁₂O₆
• 分子量: 288.257
• InChiKey: OCBULSOSSZWTDA-UHFFFAOYSA-N

物化性质

• 熔点：
  80 °C(Solv: ligroine (8032-32-4))
• 沸点：
  455.9±35.0 °C(Predicted)
• 密度：
  1?+-.0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  2.9
• 重原子数：
  21
• 可旋转键数：
  9
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  78.9
• 氢给体数：
  0
• 氢受体数：
  6

反应信息

• 作为反应物：
  描述：

  pyrogallol triacrilate 以 氯仿 为溶剂， 反应 2.5h， 生成 mono(2,2',2''-((benzene-1,2,3-triyltris(oxy))tris(3-oxopropane-3,1-diyl))tris(6,7-dimethoxy-2-methyl-1,2,3,4-tetrahydroisoquinolin-2-ium)) monoiodide
  参考文献：
  名称：

  Stenlake; Waigh; Dewar, European Journal of Medicinal Chemistry, 1983, vol. 18, # 3, p. 273 - 276

  摘要：

  DOI：
• 作为产物：
  描述：

  丙烯酰氯 、 邻苯三酚 在 三乙胺 作用下， 以 乙醚 为溶剂， 反应 0.5h， 以36%的产率得到pyrogallol triacrilate
  参考文献：
  名称：

  Stenlake; Waigh; Dewar, European Journal of Medicinal Chemistry, 1983, vol. 18, # 3, p. 273 - 276

  摘要：

  DOI：

文献信息

• Composition for film formation and material for insulating film formation
  申请人：JSR CORPORATION

  公开号：US20020172652A1

  公开（公告）日：2002-11-21

  A composition for film formation capable of forming a coating film excellent in low dielectric constant characteristics, cracking resistance, modulus of elasticity, and adhesion to substrates and useful as an interlayer insulating film material in semiconductor devices, etc. The composition for film formation contains (A) at least one member selected from an aromatic polyarylene and an aromatic poly (arylene ether), (B) a polyvinylsiloxane, and (C) an organic solvent.

  一种用于制备薄膜的组合物，能够形成具有低介电常数特性、抗开裂性、弹性模量和对基底的附着力优异的涂层膜，并可用作半导体器件中的层间绝缘膜材料等。该制膜组合物包含（A）至少一种选自芳香族聚芳烃和芳香族聚（芳烃醚）的成员，（B）聚乙烯基硅氧烷和（C）有机溶剂。
• Photosensitive coatings containing crosslinked beads
  申请人：E.I. DU PONT DE NEMOURS AND COMPANY

  公开号：EP0092783A2

  公开（公告）日：1983-11-02

  Photosensitive coating composition consisting essentially of an ethylenic unsaturated compound, a photoinitiator or photoinitiator system, an organic polymeric binder, discrete, substantially nonswellable, nonagglomerating, crosslinked beads, 0.1 to 4.0 µm in average diameter size, at least 90% of the beads by population below 10 µm, as defined and a solvent for the binder. The crosslinked beads can be present in positive-working systems. Preferred beads are trimethylolpropane triacrylate. The coating composition can be dried quickly into the form of a film which is useful as a dry film photoresist.

  感光涂层组合物，主要由乙烯基不饱和化合物、光引发剂或光引发剂体系、有机聚合物粘合剂、离散的、基本不溶胀的、不团聚的、交联的珠子（平均直径为 0.1 至 4.0 微米，至少 90% 的珠子数量低于 10 微米）和粘合剂溶剂组成。交联珠可以存在于正工作系统中。首选的珠子是三羟甲基丙烷三丙烯酸酯。涂层组合物可以快速干燥成膜，用作干膜光刻胶。
• LAMINATE AND METHOD FOR FORMATION THEREOF, INSULATING FILM, SEMICONDUCTOR DEVICE, AND COMPOSITION FOR FORMING FILM
  申请人：JSR Corporation

  公开号：EP1679184A1

  公开（公告）日：2006-07-12

  A laminate having a low relative dielectric constant and exhibiting excellent adhesion, a method of forming the laminate, an insulating film, a semiconductor device, and a film-forming composition are provided. A laminate according to the invention includes: a first silica-based film; a second silica-based film; and an organic film, wherein the second silica-based film includes a monovalent organic group containing a carbon-carbon double bond or a carbon-carbon triple bond. A method of forming a laminate according to the invention includes: forming a first coating for a first silica-based film on a substrate; forming a second coating for a second silica-based film on the first coating, the second coating including a monovalent organic group containing a carbon-carbon double bond or a carbon-carbon triple bond; forming a third coating for an organic film on the second coating; and curing a multilayer film including the first to third coatings.

  本发明提供了一种具有低相对介电常数并表现出优异附着力的层压板、一种形成该层压板的方法、一种绝缘膜、一种半导体器件和一种成膜组合物。 根据本发明的层压板包括：第一硅基薄膜；第二硅基薄膜；以及有机薄膜，其中第二硅基薄膜包括含有碳碳双键或碳碳三键的一价有机基团。 根据本发明形成层压板的方法包括：在基底上形成第一硅基薄膜的第一涂层；在第一涂层上形成第二硅基薄膜的第二涂层，第二涂层包括含有碳碳双键或碳碳三键的一价有机基团；在第二涂层上形成有机薄膜的第三涂层；以及固化包括第一至第三涂层的多层薄膜。
• Polymer, process for production, composition for film formation containing the same, method of film formation, and insulating film
  申请人：JSR CORPORATION

  公开号：US20020161173A1

  公开（公告）日：2002-10-31

  a composition for film formation which can be cured in a short time period and give a film having a low dielectric constant and excellent in heat resistance, adhesion and cracking resistance, a polymer for use in the composition and a process for producing the polymer. The composition prepared by dissolving the polymer having specific repeating units in a solvent has excellent film-forming properties. The polymer has repeating units represented by the following general formula (1): 1 wherein Z and Y are as defined hereinabove.

  一种可在短时间内固化并能形成具有低介电常数和优异耐热性、粘附性和抗裂性的薄膜的成膜组合物、一种用于该组合物的聚合物以及一种生产该聚合物的工艺。将具有特定重复单元的聚合物溶解在溶剂中制备的组合物具有优异的成膜性能。该聚合物具有由以下通式（1）表示的重复单元： 1 其中 Z 和 Y 如上文所定义。
• Stacked film, insulating film and substrate for semiconductor
  申请人：JSR CORPORATION

  公开号：US20030077461A1

  公开（公告）日：2003-04-24

  A stacked film for semiconductor having superior adhesion to a coating film formed by a CVD process in, for example, semiconductor devices, an insulating film having the stacked film and a substrate for semiconductor using the insulating film are disclosed. The stacked film comprises (A) a film of an organic compound having a carbon content of 60% by weight or more and (B) a film prepared by heating a hydrolytic condensate obtained by hydrolysis and condensation of at least one compound selected from the group consisting of specific compounds represented by the general formulae (51) to (54) described hereinabove.

  本发明公开了一种在半导体器件等中与通过 CVD 工艺形成的涂膜具有优异附着力的半导体用叠层膜、具有该叠层膜的绝缘膜以及使用该绝缘膜的半导体用基板。叠层膜包括(A)碳含量大于等于 60%（重量百分比）的有机化合物膜和(B)通过加热至少一种选自上述通式(51)至(54)所代表的特定化合物的水解缩合物而制备的膜。