申请人:Rohm and Haas Electronic Chemicals, L.L.C.
公开号:US20040262751A1
公开(公告)日:2004-12-30
Compositions suitable for use as underfill materials in an integrated circuit assembly are provided. Also provided are methods of preparing integrated circuit assemblies containing certain underfill materials as well as electronic devices containing such integrated circuit assemblies.
本文提供了适合用作集成电路组件底部填充材料的组合物。此外,还提供了制备含有某些底部填充材料的集成电路组件以及含有此类集成电路组件的电子设备的方法。