2-[(2-氨基-3-氯苯基)甲基]-6-氯苯胺 | 3813-08-9

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 中文名称: 2-[(2-氨基-3-氯苯基)甲基]-6-氯苯胺
• 英文名称: 2,2'-Methylenebis(6-chloroaniline)
• 英文别名: 2-[(2-amino-3-chlorophenyl)methyl]-6-chloroaniline
• CAS: 3813-08-9
• 化学式: C₁₃H₁₂Cl₂N₂
• 分子量: 267.15
• InChiKey: QRNOKNRQGABGFX-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.7
• 重原子数：
  17
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.08
• 拓扑面积：
  52
• 氢给体数：
  2
• 氢受体数：
  2

文献信息

• Polyol and rigid polyurethane foam
  申请人：MITSUI TOATSU CHEMICALS, Inc.

  公开号：EP0431756A2

  公开（公告）日：1991-06-12

  The present invention relates to a polyol, polyurethane resin, rigid polyurethane foam, preparation process thereof and a preparation process of a rigid polyurethane foam composite. The polyol used in the present invention comprises an epoxy resin base polyol, phenol resin base polyol component and aromatic amine base polyol component. The above polyurethane resin, foam and composite using above polyol as raw material have resistance to dissolution in a hydrochlorofluorocarbon and hydrofluorocarbon which are foaming agents having very low public hazards. The above-mentioned foam products have excellent physical properties equivalent to those of conventional polyurethane foams obtained by using chlorofluorocarbon as foaming agent, and hence are very useful as a thermal insulation material or a thermal insulation structure for refrigerators, freezers, insulation panels, ships and vehicles.

  本发明涉及一种多元醇、聚氨酯树脂、硬质聚氨酯泡沫塑料、其制备工艺和硬质聚氨酯泡沫塑料复合材料的制备工艺。 本发明中使用的多元醇包括环氧树脂基多元醇、酚醛树脂基多元醇组分和芳香胺基多元醇组分。 以上述多元醇为原料的上述聚氨酯树脂、泡沫塑料和复合材料具有抗溶解于氯氟烃和氢氟烃的性能，而氯氟烃和氢氟烃是对公众危害极低的发泡剂。 上述泡沫塑料产品具有与使用氯氟烃作为发泡剂获得的传统聚氨酯泡沫塑料相当的优异物理性能，因此非常适用于冰箱、冰柜、隔热板、船舶和车辆的隔热材料或隔热结构。
• POLYIMIDE RESIN FILM
  申请人：KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA

  公开号：EP0483376A1

  公开（公告）日：1992-05-06

  A resin film for mainly making a flexible printed circuit board and a method of making the film. When a copper foil (2) is etched in a specified pattern after heat-bonded to a resin film (1) in order to make a flexible printed circuit board, said board undergoes a dimensional variation. For the purpose of reducing such dimensional variation, a ration (a/b) of a linear expansion coefficient (a) of the resin film (1) in the mechanical feeding direction (MD direction) to that (b) in the direction (TD direction) perpendicular to said mechanical feeding one is set at 0.2 or more but less than 1.0, and the linear expansion coefficient in said mechanical feeding direction (MD direction) is set at 0.4 to 2.0 x 10⁻⁵°C⁻¹. As a resin film, a polyimide film including 90 % or more of identity period represented by a specified general formula is used. Further, for making said resin film, the film (1) is stretched 1.0 to 1.5 times in the mechanical feeding direction (MD direction) and 0.5 to 0.99 times in the direction (TD direction) perpendicular to the mechanical direction.

  一种主要用于制作柔性印刷电路板的树脂薄膜及其制作方法。当铜箔（2）与树脂薄膜（1）热粘合后按特定图案蚀刻，以制作柔性印刷电路板时，该电路板会发生尺寸变化。为了减少这种尺寸变化，将树脂薄膜 (1) 在机械进给方向（MD 方向）上的线膨胀系数 (a) 与在垂直于所述机械进给方向（TD 方向）上的线膨胀系数 (b) 之比 (a/b) 设置为 0.2 或以上但小于 1.0，并且将所述机械进给方向（MD 方向）上的线膨胀系数设置为 0.4 至 2.0 x 10-⁵°C-¹。作为树脂薄膜，使用聚酰亚胺薄膜，其中包括 90% 或更多由指定通式表示的特性期。此外，在制造所述树脂薄膜时，薄膜（1）在机械进料方向（MD 方向）上拉伸 1.0 至 1.5 倍，在垂直于机械方向的方向（TD 方向）上拉伸 0.5 至 0.99 倍。
• Radiation sensitive polymer composition
  申请人：TORAY INDUSTRIES, INC.

  公开号：EP0878740A1

  公开（公告）日：1998-11-18

  An actinic radiation sensitive polymer composition containing (a) a polyimide precursor obtainable by the interaction of an amine compound having a photocrosslinking group with carboxyl groups of a poly(amic acid) chain, and (b) a photoinitiator and/or photosensitizer, in which the degree of imidization Ia is 0.03 ≤ Ia ≤ 0.6, has the characteristic features of both good stability of viscosity with lapse of time and good photosensitive performance.

  一种对辐照敏感的聚合物组合物，其中含有 (a) 聚酰亚胺前体，可通过具有光交联基团的胺化合物与聚(氨基)酸链的羧基相互作用获得，以及 (b) 光引发剂和/或光敏剂、 其中亚胺化程度 Ia 为 0.03 ≤ Ia ≤ 0.6，具有随时间推移粘度稳定性好和光敏性能好的特点。
• Photosensitive heat resistant resin precursor composition
  申请人：TORAY INDUSTRIES, INC.

  公开号：EP1388758A1

  公开（公告）日：2004-02-11

  A photosensitive resin precursor composition exhibiting an excellent film thickness uniformity contains: a heat resistant resin precursor polymer; a radiation sensitive compound; and a solvent expressed by formula (1): R1 represents an alkyl group having a carbon number in the range of 1 to 3. R2, R3, R4, and R5 each represent hydrogen or an alkyl group having a carbon number in the range of 1 to 3, and 1 represents an integer in the range of 0 to 3.

  一种具有优异膜厚均匀性的光敏树脂前体组合物包含：一种耐热树脂前体聚合物；一种辐射敏感化合物；以及一种由式（1）表示的溶剂： R1 代表碳数在 1 至 3 之间的烷基。R2、R3、R4 和 R5 分别代表氢或碳原子数在 1 至 3 之间的烷基，1 代表 0 至 3 之间的整数。
• COMPOSITION FOR OPTICAL MATERIAL
  申请人：MITSUBISHI GAS CHEMICAL COMPANY, INC.

  公开号：EP1426392A1

  公开（公告）日：2004-06-09

  The composition for optical materials of the present invention comprises a compound having in one molecule at least one structure represented by the following formula (1): wherein R1, R2, R3, R4, X, Y and n are as defined in the disclosure, an amine compound and an isocyanate compound. Resins obtained by curing the composition by polymerization are useful as well-balanced optical materials having a high impact resistance, a high refractive index and a sufficiently high Abbe's number.

  本发明的光学材料组合物包括在一个分子中至少具有下式（1）所代表的一种结构的化合物： 其中 R1、R2、R3、R4、X、Y 和 n 如公开资料中所定义；胺化合物和异氰酸酯化合物。通过聚合固化组合物得到的树脂可用作具有高抗冲击性、高折射率和足够高的阿贝数的均衡光学材料。