There is provided a composition including an alkoxysilylated epoxy compound, a composition of which exhibits good heat resistance properties, low CTE and high glass transition temperature or Tg-less and not requiring a separate coupling agent, and inorganic particles, a cured product formed of the composition, and a use of the cured product. An epoxy composition including an alkoxysilylated epoxy compound and inorganic particles, an epoxy composition including an epoxy compound, inorganic particles and a curing agent, a cured product of the composition, and a use of the composition are provided. Since chemical bonds may be formed between the alkoxysilyl group and the inorganic particles and between the alkoxysilyl groups, a composition of the composition including the alkoxysilylated epoxy compound and the inorganic particles exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less.
提供一种包括烷
氧硅基化环
氧化合物的组合物,该组合物的性质具有良好的耐热性能,低CTE和高
玻璃转变温度或Tg-无需单独的
偶联剂,并且包括无机颗粒,所述组合物形成的固化产物,以及所述固化产物的用途。提供一种包括烷
氧硅基化环
氧化合物和无机颗粒的环
氧组合物,一种包括环
氧化合物、无机颗粒和固化剂的环
氧组合物,所述组合物的固化产物,以及所述组合物的用途。由于烷
氧硅基团与无机颗粒之间以及烷
氧硅基团之间可能形成
化学键,因此包括烷
氧硅基化环
氧化合物和无机颗粒的组合物具有改善的耐热性能、降低的CTE和增加的
玻璃转变温度或Tg less。