3,3'-isopropylidene-di-benzoic acid | 22452-69-3

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 3,3'-isopropylidene-di-benzoic acid
• 英文别名: 3,3'-Isopropyliden-di-benzoesaeure；2,2-bis(3-carboxyphenyl)propane；3-[2-(3-Carboxyphenyl)propan-2-yl]benzoic acid
• CAS: 22452-69-3
• 化学式: C₁₇H₁₆O₄
• 分子量: 284.312
• InChiKey: BZVMGPSXJDFUPI-UHFFFAOYSA-N

物化性质

• 熔点：
  297-299 °C
• 沸点：
  486.7±38.0 °C(Predicted)
• 密度：
  1.248±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  3.8
• 重原子数：
  21
• 可旋转键数：
  4
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.18
• 拓扑面积：
  74.6
• 氢给体数：
  2
• 氢受体数：
  4

反应信息

• 作为产物：
  描述：

  2,2-二氯丙烷 、 甲苯 在 三氯化铝 作用下， 生成 2,2-Bis-(p-carboxyphenyl)-propan 、 3,3'-isopropylidene-di-benzoic acid
  参考文献：
  名称：

  Novel dibasic aromatic acids and derivatives thereof

  摘要：

  公开号：

  US02794822A1

文献信息

• ACETYLENE COMPOUND, SALT THEREOF, CONDENSATE THEREOF, AND COMPOSITION THEREOF
  申请人：Fujifilm Corporation

  公开号：EP2202220A1

  公开（公告）日：2010-06-30

  [Problem to be Solved] To provide an acetylene compound having a structure in which a unit having an amino group and a unit having an ethynyl group are bonded via a linking group, the acetylene compound being introducable to a polymer having thermal resistance. [Means for Solving the Problem] An acetylene compound represented by the following Formula (1) and a salt thereof: wherein in Formula (1), X represents a single bond or a divalent linking group; A represents a hydrocarbon group, a heteroaromatic ring or a heteroalicyclic compound; B represents a hydrocarbon group, a heteroaromatic ring, a heteroalicyclic compound or a single bond; R1 represents a hydrogen atom, a hydrocarbon group, a heteroaromatic ring, a heteroalicyclic compound or a silyl group; R4 represents a hydrogen atom or a group that can be a substituent of an amino group; and m, n and a each independently represent an integer of 1 or greater.

  解决的问题是提供一种乙炔化合物，其结构中含有通过连接基团连接的具有氨基团和乙炔基团的单元，该乙炔化合物可引入到具有热阻抗的聚合物中。解决问题的方法是通过以下式（1）表示的乙炔化合物及其盐：其中在式（1）中，X代表单键或二价连接基团；A代表烃基团、杂环芳香环或杂环脂环化合物；B代表烃基团、杂环芳香环、杂环脂环化合物或单键；R1代表氢原子、烃基团、杂环芳香环、杂环脂环化合物或硅基团；R4代表氢原子或可作为氨基团的取代基团；m、n和a分别独立表示大于或等于1的整数。
• Fluorine-Containing Polymerizable Monomer And Polymer Compound Using Same
  申请人：Central Glass Company, Limited

  公开号：US20140148548A1

  公开（公告）日：2014-05-29

  The present invention provides a fluorine-containing fluorenediamine of the formula (2): where R 1 represents one kind of substituent group selected from the group consisting of a hydrogen atom, a fluorine atom, a chlorine atom, a bromine atom, a C 1 -C 4 alkyl group, a C 1 -C 4 fluoroalkyl group in which any number of hydrogen atoms can be substituted by a fluorine atom, a phenyl group, a methoxy group and a nitro group; R 2 represents one kind of substituent group selected from the group consisting of a hydrogen atom, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, a phenyl group, a naphthyl group, a biphenyl group, a sulfonic acid group, a —C≡C—C(CH 3 ) 2 OH group, a —C≡C—C 6 H 5 group and a —C≡C—Si(CH 3 ) 3 group; HFIP represents a —C(CF 3 ) 2 OH group; and m and n each independently represent an integer of 0 to 2 and satisfy a condition of 1≦m+n≦4.

  本发明提供了一种具有如下公式（2）的含氟芴二胺：其中R1代表从氢原子、氟原子、氯原子、溴原子、C1-C4烷基、C1-C4氟烷基（其中任意数量的氢原子可被氟原子取代）、苯基、甲氧基和硝基等组成的一种取代基；R2代表从氢原子、氟原子、氯原子、溴原子、碘原子、苯基、萘基、联苯基、磺酸基、—C≡C—C(CH3)2OH基、—C≡C—C6H5基和—C≡C—Si(CH3)3基等组成的一种取代基；HFIP代表—C(CF3)2OH基；m和n分别独立地表示0到2的整数，并满足1≦m+n≦4的条件。
• HYGROMORPHIC POLYMERS AND COPOLYMERS HAVING HUMIDITY-DRIVEN MOTILITY
  申请人：Government of the United States, as represented by the Secretary of the Air Force

  公开号：US20170260334A1

  公开（公告）日：2017-09-14

  New diamine monomers bearing sulfone terminated pendant groups, as well as methods for making the same, are provided. The diamine monomers are useful toward making polyamide, polyimide, and poly(amide-imide) polymers and copolymers, which possess hygromorphic properties and demonstrate humidity driven motility.

  提供了带有磺酸终端偏基团的新二胺单体及其制备方法。这些二胺单体可用于制备具有湿敏性能和表现出湿度驱动运动的聚酰胺、聚酰亚胺和聚（酰胺-亚胺）聚合物和共聚物。
• Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device
  申请人：——

  公开号：US20020013443A1

  公开（公告）日：2002-01-31

  A precursor of a polybenzoxazole resin which comprises a crosslinking group in a molecule and has a specific structure, a polybenzoxazole resin obtained from the precursor by the condensation reaction and the crosslinking reaction, an insulating film comprising the polybenzoxazole resin and a semiconductor device comprising an insulating interlayer film in multi-layer wiring or a film for protecting surfaces which comprises the above insulating film. The precursor exhibits excellent processability due to excellent solubility in solvents and, after the ring closure, excellent heat stability in applications. The resin exhibits excellent electric, physical and mechanical properties and is advantageously used for insulating interlayer films of semiconductor devices and the like applications.

  一种聚苯并咪唑树脂的前体，其分子中包含交联基团并具有特定的结构，通过缩合反应和交联反应获得的聚苯并咪唑树脂，包括聚苯并咪唑树脂的绝缘膜以及包括上述绝缘膜的多层布线中的绝缘中间层膜或用于保护表面的膜的半导体器件。由于前体在溶剂中具有优异的溶解性，因此表现出优异的加工性能，并且在环闭后具有优异的热稳定性能，树脂表现出优异的电学、物理和机械性能，可优点地用于半导体器件的绝缘中间层膜等应用。
• Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same
  申请人：——

  公开号：US20040002572A1

  公开（公告）日：2004-01-01

  A material for an insulating film which comprises a copolymer obtained by reacting a polyamide having a specific structure and a reactive oligomer as a component forming the film; a coating varnish for an insulating film which comprises this material and an organic solvent; an insulating film which comprises a layer of a resin comprising as a main structure a polybenzoxazole which is obtained by treating the above material or the above coating varnish by heating so that condensation reaction and crosslinking reaction take place and has fine pores; and a semiconductor device which comprises an insulating interlayer film for multi-layer wiring comprising the insulating film and/or a surface protective film comprising the insulating film. Excellent electrical, thermal and mechanical properties are exhibited and a low permittivity can be achieved.

  一种绝缘薄膜材料，包括由特定结构的聚酰胺和反应性低聚物作为成膜组分所反应得到的共聚物；一种用于绝缘薄膜的涂覆清漆，包括该材料和有机溶剂；一种绝缘薄膜，包括一层树脂，其主要结构为通过热处理上述材料或上述涂覆清漆得到的聚苯并咪唑，发生缩聚反应和交联反应并具有细小孔隙；以及一种半导体器件，包括用于多层布线的绝缘中间层膜，包括上述绝缘薄膜和/或表面保护膜，包括上述绝缘薄膜。具有优异的电性能、热性能和机械性能，并且可以实现低介电常数。