申请人:KONISHI CO., LTD.
公开号:EP0566780A1
公开(公告)日:1993-10-27
Disclosed is a heat-resistant resin composition prepared by mixing (A) a resin composition and (B) a hardener of an epoxy resin, followed by heating the mixture for curing, said composition (A) being prepared by heating a mixture of (a) a polymaleimide resin represented by the following general formula:
(wherein R₁ represents an organic group having a valency of n, Xa and Xb represent monovalent atoms or groups which are the same or different and selected from a hydrogen atom, a halogen atom, and an organic group, and n represents 1 to 4), (b) an epoxy resin having at least two epoxy groups in a molecule thereof, and (c) a compound containing at least one hydroxyl group, at least one carboxyl group, or both at least one hydroxyl group and at least one carboxyl group in a molecule thereof.
本发明公开了一种耐热树脂组合物,其制备方法是混合(A)树脂组合物和(B)环氧树脂固化剂,然后加热混合物使其固化,所述组合物(A)的制备方法是加热(a)由以下通式表示的聚马来酰亚胺树脂的混合物:
(其中,R₁ 代表化合价为 n 的有机基团,Xa 和 Xb 代表选自氢原子、卤素原子和有机基团的相同或不同的单价原子或基团,n 代表 1 至 4)、(c) 分子中含有至少一个羟基、至少一个羧基或至少一个羟基和至少一个羧基的化合物。